Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it’s potential applications for Power-Via technologies

Autor: Bo-Zhou Liao, Liang-Hsi Chen, Kai-Cheng Chen, Hong-Yi Lin, Yi-Ting Tsai, Ting-Wei Chen, Yi-Cheng Chan, Min-Hung Lee, Ming-Han Liao

Publikováno v: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9cb9f91c0ce323a85cf1fdc0ec025e75
https://doi.org/10.1109/ectc51906.2022.00285

Liquation Cracking in the Heat-Affected Zone of IN738 Superalloy Weld

Autor: Leu-Wen Tsay, Ren-Kae Shiue, Tai-Cheng Chen, Kai-Cheng Chen

Publikováno v: Metals; Volume 8; Issue 6; Pages: 387
Metals, Vol 8, Iss 6, p 387 (2018)

The main scope of this study investigated the occurrence of liquation cracking in the heat-affected zone (HAZ) of IN738 superalloy weld, IN738 is widely used in gas turbine blades in land-based power plants. Microstructural examinations showed consid

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b12a1216af017739391495543ad97a1

Surface charging‐dependent deposition of silver on gold nanorods.

Autor: Chang, Sheng‐Te¹ (AUTHOR), Dong, Wen‐Yi¹ (AUTHOR), Chen, Kai‐Cheng¹ (AUTHOR), He, Yan¹ (AUTHOR), Yen, Yi‐An¹ (AUTHOR), Kao, Chih‐Wei¹ (AUTHOR), Deng, Jin‐Pei¹ (AUTHOR) jpdeng@mail.tku.edu.tw

Publikováno v: Journal of the Chinese Chemical Society. Mar2021, Vol. 68 Issue 3, p512-516. 5p.

Solution-processed perovskite solar cells.

Autor: Chang, Jian-hui, Liu, Kun, Lin, Si-yuan, Yuan, Yong-bo, Zhou, Cong-hua, Yang, Jun-liang

Publikováno v: Journal of Central South University; Apr2020, Vol. 27 Issue 4, p1104-1133, 30p

FrontMatter.

Publikováno v: Information Security & Cryptology: 9th International Conference, Inscrypt 2013, Guangzhou, China, November 27-30, 2013, Revised Selected Papers; 2014, pI-XIII, 13p