Zobrazeno 1 - 10
of 92
pro vyhledávání: '"KOSIEL, KAMIL"'
Publikováno v:
In Expert Systems With Applications 1 October 2024 251
Autor:
Kamiński, Maciej, Taube, Andrzej, Tarenko, Jaroslaw, Sadowski, Oskar, Brzozowski, Ernest, Wierzbicka, Justyna, Zadura, Magdalena, Ekielski, Marek, Kosiel, Kamil, Jankowska‐Śliwińska, Joanna, Abendroth, Kamil, Szerling, Anna, Prystawko, Paweł, Boćkowski, Michał, Grzegory, Izabella
Publikováno v:
Physica Status Solidi. A: Applications & Materials Science; Nov2024, Vol. 221 Issue 21, p1-8, 8p
Autor:
Piestrzyńska, Monika, Dominik, Magdalena, Kosiel, Kamil, Janczuk-Richter, Marta, Szot-Karpińska, Katarzyna, Brzozowska, Ewa, Shao, Liyang, Niedziółka-Jonsson, Joanna, Bock, Wojtek J., Śmietana, Mateusz
Publikováno v:
In Biosensors and Bioelectronics 15 May 2019 133:8-15
Publikováno v:
In Optics and Laser Technology June 2018 102:213-221
Autor:
Kozubal, Maciej Artur, Szerling, Anna, Kosiel, Kamil, Myśliwiec, Marcin, Pągowska, Karolina, Jakieła, Rafał, Kruszka, Renata, Guziewicz, Marek, Barcz, Adam
Publikováno v:
In Materials Science in Semiconductor Processing February 2018 74:88-97
Autor:
Taube, Andrzej, Kaczmarski, Jakub, Kruszka, Renata, Grochowski, Jakub, Kosiel, Kamil, Gołaszewska-Malec, Krystyna, Sochacki, Mariusz, Jung, Wojciech, Kamińska, Eliana, Piotrowska, Anna
Publikováno v:
In Solid State Electronics September 2015 111:12-17
Publikováno v:
In Radiation Physics and Chemistry 2011 80(10):1112-1118
Autor:
Kosiel, Kamil, Kubacka-Traczyk, Justyna, Karbownik, Piotr, Szerling, Anna, Muszalski, Jan, Bugajski, Maciej, Romanowski, Przemek, Gaca, Jarosław, Wójcik, Marek
Publikováno v:
In Microelectronics Journal March 2009 40(3):565-569
Autor:
Rouhi, Sina, Ozdemir, Mehtap, Ekmekcioglu, Merve, Yigen, Serap, Demirhan, Yasemin, Szerling, Anna, Kosiel, Kamil, Kozubal, Maciej, Kruszka, Renata, Prokaryn, Piotr, Ertugrul, Mehmet, Reno, John L., Aygun, Gulnur, Ozyuzer, Lutfi
The choice of metals, bonding conditions and interface purity are critical parameters for the performance of metal-metal bonding quality for quantum cascade lasers (QCLs). Here, we present a novel approach for the thermocompression bonding of Cu-Cu t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=r39c86a4b39b::d0cc6a3bac8d88623e1465dac0ec9cbf
https://aperta.ulakbim.gov.tr/record/239438
https://aperta.ulakbim.gov.tr/record/239438
