Zobrazeno 1 - 10
of 48
pro vyhledávání: '"K.I. Sinclair"'
Autor:
A.K. Parrott, Marc P.Y. Desmulliez, Chris Bailey, Tim Tilford, Alan J. Sangster, George Goussetis, K.I. Sinclair
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 56:2635-2641
A physically open, but electrically shielded, microwave open oven can be produced by virtue of the evanescent fields in a waveguide below cutoff. The below cutoff heating chamber is fed by a transverse magnetic resonance established in a dielectric-f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27e5db162a033fbebd35fa55cb4be9e6
https://doi.org/10.1109/tmtt.2008.2005925
https://doi.org/10.1109/tmtt.2008.2005925
Publikováno v:
IET Microwaves, Antennas & Propagation. 2:53-58
A novel open-ended waveguide cavity resonator for the microwave curing of bumps, underfills and encapsulants is described. The open oven has the potential to provide fast alignment of devices during flip-chip assembly, direct chip attach, surface mou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b46242ed0bcfc18b97ea90301b1da34
https://doi.org/10.1049/iet-map:20060316
https://doi.org/10.1049/iet-map:20060316
Autor:
Tim Tilford, Chris Bailey, A.K. Parrott, Alan J. Sangster, Marc P.Y. Desmulliez, G. Goussettis, K.I. Sinclair
Publikováno v:
Soldering & Surface Mount Technology. 19:26-33
PurposeThis paper aims to present an open‐ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the system, enabling design of physical prototypes to be optimized, ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831d6eb8d6a50ecc1271dd405d5adbcb
https://doi.org/10.1108/09540910710843757
https://doi.org/10.1108/09540910710843757
Publikováno v:
Proceedings of the New Zealand Plant Protection Conference. 52:182-186
The resistance of New Zealand barley cultivars to leaf scald, caused by Rhynchosporium secalis, was assessed under conditions of high disease pressure in two autumn-sown disease nurseries. Assessments of disease severity were made at several growth s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef45151d8984df7486ee18fa5309bb56
https://doi.org/10.30843/nzpp.1999.52.11562
https://doi.org/10.30843/nzpp.1999.52.11562
Publikováno v:
2009 32nd International Spring Seminar on Electronics Technology.
A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17d4c195017a6f63d68d2be19ad02421
https://doi.org/10.1109/isse.2009.5206929
https://doi.org/10.1109/isse.2009.5206929
Autor:
Chris Bailey, Tim Tilford, A.K. Parrott, George Goussetis, K.I. Sinclair, Alan J. Sangster, Marc P.Y. Desmulliez
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f014dc41c2337322048fbc6f66be212b
https://doi.org/10.1109/iemt.2008.5507869
https://doi.org/10.1109/iemt.2008.5507869
Autor:
Chris Bailey, Marc P.Y. Desmulliez, George Goussetis, Tim Tilford, K.I. Sinclair, Alan J. Sangster, Kevin Parrott
Publikováno v:
2008 38th European Microwave Conference.
An open-ended microwave oven in the form of an open waveguide cavity partially filled with a low loss dielectric material is proposed for the curing of polymer materials during flip-chip assembly. The open-ended nature of the design allows for simult
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6590846e7366ee39145ae879e717bc4a
https://doi.org/10.1109/eumc.2008.4751375
https://doi.org/10.1109/eumc.2008.4751375
Autor:
Tim Tilford, A.K. Parrott, Alan J. Sangster, Chris Bailey, Marc P.Y. Desmulliez, George Goussetis, K.I. Sinclair
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b0adb5917edf8d0bf421a1b01157f45c
https://doi.org/10.1109/estc.2008.4684409
https://doi.org/10.1109/estc.2008.4684409
Autor:
J. Rizvi, A.K. Parrott, Marc P.Y. Desmulliez, K.I. Sinclair, Tim Tilford, Chunyan Yin, Chris Bailey
Publikováno v:
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f62f3cb23b4e61277826c38a71c1f7ee
https://doi.org/10.1109/icept.2008.4607039
https://doi.org/10.1109/icept.2008.4607039
Autor:
A.K. Parrott, George Goussetis, K.I. Sinclair, Marc P.Y. Desmulliez, Tim Tilford, Alan J. Sangster, Chris Bailey
Publikováno v:
2008 31st International Spring Seminar on Electronics Technology.
Encapsulant curing using a Variable Frequency Microwave (VFM) system is analysed numerically. Thermosetting polymer encapsulant materials require an input of heat energy to initiate the cure process. In this article, the heating is considered to be p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06fd6657c76e35344d8bd6c50ce5bac4
https://doi.org/10.1109/isse.2008.5276666
https://doi.org/10.1109/isse.2008.5276666