Zobrazeno 1 - 10
of 25
pro vyhledávání: '"K.A. Moores"'
Publikováno v:
International Journal of Heat and Mass Transfer. 52:5978-5989
Shrouded pin fin arrays with tip clearances ( Cg ) up to 25% of pin height were experimentally evaluated. Pressure loss was measured (2 × 10 2 Re D 4 ) and liquid crystal thermography was employed to obtain temperature distributions from which the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44f684e87b2e4a131f53258b78ad3c01
https://doi.org/10.1016/j.ijheatmasstransfer.2009.08.005
https://doi.org/10.1016/j.ijheatmasstransfer.2009.08.005
Autor:
K.A. Moores, Yogendra Joshi
Publikováno v:
Journal of Heat Transfer. 125:999-1006
The effect of introducing tip clearance to a liquid cooled array of shrouded pins fins is examined. Three arrays of height to diameter ratio ranging from 0.5 to 1.1 were evaluated experimentally. The arrays were exposed to a uniform heat flux of 0.02
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b598d37df67d1d985f0c7c54cb229f1e
https://doi.org/10.1115/1.1621897
https://doi.org/10.1115/1.1621897
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 24:213-219
In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambere
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::221d29b6225223094ac55618ddad0a35
https://doi.org/10.1109/6144.926385
https://doi.org/10.1109/6144.926385
Publikováno v:
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407).
Thermoelectric cooling (TEC) modules which are rated for operation up to 200/spl deg/C are now widely available commercially, making them potential candidates for use in the thermal management of high temperature electronics applications. Through the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::637bdbad26065ef20e0afc7920630ed4
https://doi.org/10.1109/ict.1999.843328
https://doi.org/10.1109/ict.1999.843328
Publikováno v:
Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).
The fluid flow and heat transfer characteristics of a SEM-E electronics cooling module were simulated numerically by representing the internal offset fin structure with a Brinkman-Forchheimer-extended Darcy porous media model. A simplified mock-up of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::388240bba3cb3e09aa856a784cefb9af
https://doi.org/10.1109/stherm.1998.660390
https://doi.org/10.1109/stherm.1998.660390
Publikováno v:
Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).
Until recently, the choice of die attach materials in hermetic packaging for space applications has been limited to three types: silver-glass, gold-silicon eutectic, and polyimide film or paste. The performance of each die bond material varies with d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b699be1bde965a5ecda7952463fd6fe4
https://doi.org/10.1109/adhes.1998.742002
https://doi.org/10.1109/adhes.1998.742002
Publikováno v:
ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambere
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e678f97f392bbe7eb737dd8af3d2866
https://doi.org/10.1109/itherm.2000.866219
https://doi.org/10.1109/itherm.2000.866219
Autor:
K.A. Moores, Yogendra Joshi
Publikováno v:
Journal of Heat Transfer. 128:857-857
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::275209e56879ef2bff7e5ef0ac6e5c22
https://doi.org/10.1115/1.2227055
https://doi.org/10.1115/1.2227055
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