Zobrazeno 1 - 10
of 375
pro vyhledávání: '"K.-J. Wolter"'
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The PCB embedding technology has continuously been developed and is increasingly used in the miniaturization efforts of today's electronic systems. Passive components and active IC components are desired to be integrated into printed circuit boards.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fdb041efb28f0c520db6bc7b41131ba
https://doi.org/10.1109/eurosime.2018.8369913
https://doi.org/10.1109/eurosime.2018.8369913
Publikováno v:
Microelectronic Engineering. 137:105-110
Display Omitted We model thermo-mechanical stresses in silicon after annealing of TSVs.Results deliver detailed stress information of specific stress components.FEM demonstrates that the induced stress distribution is complex and cannot be described
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5ca7a14c8008c39160d55f7fd6f5b5f
https://doi.org/10.1016/j.mee.2015.01.024
https://doi.org/10.1016/j.mee.2015.01.024
Autor:
E. Zschech, P. Sättler, M. Löffler, J. Gluch, Martin Oppermann, M. Röllig, N. Meyendorf, K.-J. Wolter
Publikováno v:
AIP Conference Proceedings.
New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the “DRAM half pitch” over t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75f5f7b408d949bc2b74a337bf24186
https://doi.org/10.1063/1.4940472
https://doi.org/10.1063/1.4940472
New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the “DRAM half pitch” over t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d120cfe5115b13e3e294fd02bcbe86f5
https://tud.qucosa.de/id/qucosa:35100
https://tud.qucosa.de/id/qucosa:35100
Publikováno v:
International Journal of Production Research. 50:6122-6132
One of the most promising approaches in modern microelectronics is the introduction of 3D chip micro systems with through-silicon via (TSV) interconnections. A successful transfer of this technology from the scientific level up to the level of mass p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7434a462986c44f712d942db06ced2be
https://doi.org/10.1080/00207543.2012.661889
https://doi.org/10.1080/00207543.2012.661889
Autor:
T. Lohse, P. Krüger, Thomas Zerna, H. Torlee, Henning Heuer, Martin Oppermann, Norbert Meyendorf, K.-J. Wolter
Publikováno v:
Procedia Engineering. 25:459-462
In this paper an assembly concept of the radiation resistant, direct converting X-ray line detector is presented. In addition to efforts on radiation protection of sensitive electronics, realization of arranging several sensor modules is discussed. F
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a455e9ad1237ce570299f1f05ff9128d
https://doi.org/10.1016/j.proeng.2011.12.114
https://doi.org/10.1016/j.proeng.2011.12.114
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The paper presents experimental results on tin-based solder alloys to their mechanical visco-plastic deformation behaviour under systematically investigation of cooling rates and their micro-structural solidification.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61ee3dfe2c7a47d3415f05f1de35dc99
https://doi.org/10.1109/eurosime.2015.7103159
https://doi.org/10.1109/eurosime.2015.7103159
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::234776184b36c44df302755a22847694
https://doi.org/10.1109/estc.2014.6962712
https://doi.org/10.1109/estc.2014.6962712
Autor:
R. Metasch, Karsten Meier, Mike Roellig, Roumen Ratchev, B. Metais, A. Kabakchiev, K.-J. Wolter
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fed34417db166f51ac8d01eb7a87cc4c
https://doi.org/10.1109/eurosime.2014.6813860
https://doi.org/10.1109/eurosime.2014.6813860
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper will present the research results for reliability of two embedding technologies in comparison to the current standard - surface mount technology. The chosen embedding approaches utilize a cavity to place the necessary components into the P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60e6b33d6fd46a14dcf4d2248ec3fb5c
https://doi.org/10.1109/eurosime.2014.6813776
https://doi.org/10.1109/eurosime.2014.6813776