Zobrazeno 1 - 10
of 515
pro vyhledávání: '"K.-D. Lang"'
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb62dc20f339b0b83a406053c5d19198
https://doi.org/10.23919/icep55381.2022.9795437
https://doi.org/10.23919/icep55381.2022.9795437
Autor:
Uwe Maas, Lars Boettcher, Andreas Ostmann, Manuel Seckel, Martin Schneider-Ramelow, Rolf Aschenbrenner, Stefan Kosmider, K-D. Lang, Ivan Ndip, Dionysios Manessis, Kavin Senthil Murugesan
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
This paper brings into light all the new developmental work performed in the wide domain of high frequency PCBs for the realisation of innovative metasurfaces at 5GHz as well as compact highly integrated 5G antenna-in-modules at 40 GHz. There is a fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10eea79b4fef5effe637f4830fe0e906
https://doi.org/10.23919/empc53418.2021.9584975
https://doi.org/10.23919/empc53418.2021.9584975
Autor:
Tina Thomas, M. Schmied, P. Fruehauf, R. Fust, D. Schütze, Martin Schneider-Ramelow, Tanja Braun, M. Kreitmair, Steve Voges, W. Neifer, M. Heimann, S. Nerreter, K.-F. Becker, S. Gottwald, B. Schröder, A. Hofmeister, K-D. Lang, R. Blank
Publikováno v:
International Symposium on Microelectronics. 2019:000415-000422
Paper Abstract The PCB 4.0 research project offers the opportunity to take the flexibility, energy efficiency, and resource efficiency of production processes to a whole new level through intelligent control and networking. The development of electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c057bc78b58cd5a0c2b096c785773e4e
https://doi.org/10.4071/2380-4505-2019.1.000415
https://doi.org/10.4071/2380-4505-2019.1.000415
Autor:
Dionysios Manessis, G. Varnava, Kypros M. Kossifos, Christos Liaskos, Maria Kafesaki, Alexandros Pitilakis, A. Ostmann, L. Fu, Odysseas Tsilipakos, Manuel Seckel, Anna C. Tasolamprou, K-D. Lang, Sergei A. Tretyakov, Costas M. Soukoulis, Julius Georgiou, Rolf Aschenbrenner, Martin Schneider-Ramelow
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
openaire: EC/H2020/736876/EU//VISORSURF The proposed work is performed in the framework of the FET-EU project "VISORSURF", which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e6782d654ab95fdd82a0d322f1861be
https://aaltodoc.aalto.fi/handle/123456789/101649
https://aaltodoc.aalto.fi/handle/123456789/101649
Autor:
Martin Schneider-Ramelow, V. Bader, Gerd Jungmann, S. Voges, Jeremias Pauls, Karl-Friedrich Becker, Tanja Braun, Mathias Minkus, Hubert Wieser, K-D. Lang
Publikováno v:
International Symposium on Microelectronics. 2017:000182-000187
The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831fa1e1084a2cd230786883d4488bf4
https://doi.org/10.4071/isom-2017-wa15_077
https://doi.org/10.4071/isom-2017-wa15_077
Autor:
Lutz Stobbe, K.-F. Becker, Martin Schneider-Ramelow, K-D. Lang, Lars Boettcher, Ole Hoelck, M. Voitel, Tanja Braun, Steve Voges, Michael Topper, Rolf Aschenbrenner
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
Drivers for 3D packaging solutions are manifold and each requirement calls for different answers and technologies. Main goal is miniaturization, but component density and performance, simplification of design and assembly, flexibility, functionality
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5867a6d0121cd950d3f7c9fbf2bb3574
https://doi.org/10.1109/icsj47124.2019.8998753
https://doi.org/10.1109/icsj47124.2019.8998753
Autor:
Tanja Braun, Steve Voges, K.-F. Becker, Martin Schneider-Ramelow, R. Kahle, K-D. Lang, O. Holck, Marc Dreissigacker, J. Bauer, Rolf Aschenbrenner
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Within the European funded project smart-MEMPHIS the goal was to tackle the main challenge for all smart devices – self-powering. The project was aimed to design, manufacture and test a miniaturized autonomous energy supply based on harvesting vibr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d507048d2bdcb3012702fbab56321ec8
https://doi.org/10.23919/iwlpc.2019.8914021
https://doi.org/10.23919/iwlpc.2019.8914021
Autor:
Maria Kafesaki, G. Varnava, Costas M. Soukoulis, Rolf Aschenbrenner, Anna C. Tasolamprou, Kypros M. Kossifos, Manuel Seckel, Julius Georgiou, L. Fu, A. Ostmann, Odysseas Tsilipakos, Christos Liaskos, Sergei A. Tretyakov, Alexandros Pitilakis, Dionysios Manessis, Martin Schneider-Ramelow, K-D. Lang
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
openaire: EC/H2020/736876/EU//VISORSURF The proposed work is performed in the framework of the FET-EU project ' VISORSURF^{J\prime}, which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::93a21814a3ef46233edeed3486455d85
https://doi.org/10.23919/empc44848.2019.8951834
https://doi.org/10.23919/empc44848.2019.8951834
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Three-dimensional printing and rapid prototyping are becoming more and more important in the field of research and low volume production. There are many systems that can print a wide variety of materials. In the field of thin-film technology, as requ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61780055063f03728907d6f78f830959
https://doi.org/10.23919/empc44848.2019.8951872
https://doi.org/10.23919/empc44848.2019.8951872
Autor:
L. Boettcher, K-D. Lang, L. Stobbe, O. Hoelck, S. Voges, Martin Schneider-Ramelow, Tanja Braun, M. Toepper, Rolf Aschenbrenner, K.-F. Becker, M. Woehrmann
Publikováno v:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46750abff767f57ffeea3547c9d0fc67
https://doi.org/10.23919/ltb-3d.2019.8735124
https://doi.org/10.23919/ltb-3d.2019.8735124