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Confinement effects, surface effects, and transport in Bi and Bi

Autor: K, Vandaele, M, Otsuka, Y, Hasegawa, J P, Heremans

Publikováno v: Journal of physics. Condensed matter : an Institute of Physics journal. 30(40)

Hicks and Dresselhaus predicted that quantum well and nanowire thermoelectric materials could show a meaningful enhancement of the heat-to-electricity conversion efficiency compared to their bulk counterparts. The unique transport properties of bismu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=pmid________::bde97e807e3fd966217204b01d13740c
https://pubmed.ncbi.nlm.nih.gov/30113014

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The influence of heat treatment parameters on pyrolysed TFA-derived YBCO films deposited by inkjet printing

Autor: Bartek A. Glowacki, K. Vandaele, A. Patel, M. Mosiadz, I. Van Driessche, Simon C. Hopkins

Publikováno v: Materials Research Bulletin. 47:2032-2039

An anhydrous TFA-derived YBa2Cu3O7−δ precursor solution was deposited on all chemical solution deposition fully buffered metallic tape by means of electromagnetic drop-on-demand inkjet printing and pyrolysed in a flowing wet O2 atmosphere. The inf

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1e670d6f372aec9e3131a314fdd73917
https://doi.org/10.1016/j.materresbull.2012.04.002

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Inkjet Printing, Pyrolysis and Crystallisation of YBa2Cu3O7-δ Precursor Layers for Fully Chemical Solution Deposited Coated Conductors

Autor: K. L. Juda, I. Van Driessche, Martina Dr. Falter, K. Vandaele, Simon C. Hopkins, M. Mosiadz, B.A. Glowacki, A. Patel, J. Soloducho, Michael Bäcker

Publikováno v: Physics Procedia. 36:1450-1455

A complete reaction path for the pyrolysis of trifluoroacetate-derived YBa2Cu3O7-! precursor solution is reported based on the authors’ investigations of the separate trifluoroacetate salt decompositions using thermal analysis and infrared spectros

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6e7c551347a444f1c4ddb228ecd86ba4

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Akademický článek

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Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

Autor: Eddy Blansaer, A. Ivankovic, Yung-Yu Hsu, Martijn Defloor, Mireia Bargallo Gonzalez, Daniel Vanderstraeten, D. Degryse, K. Vandaele, Renaud Gillon, Kris Vanstreels, Bart Vandevelde, Guy Brizar

Publikováno v: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::dc4c5789ba32c6160f2f59e1450f476d
https://doi.org/10.1109/esime.2011.5765846

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