Zobrazeno 1 - 10
of 53
pro vyhledávání: '"K. Van Schuylenbergh"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:372-378
Micro-springs for integrated circuit test and packaging are demonstrated as soldered flip chip interconnects in a direct die to printed circuit board package. The spring interconnects are fabricated with thin film metallization as the last step in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e7175a427ca4b2365ea9fbcf30e74da
https://doi.org/10.1109/tadvp.2008.2010507
https://doi.org/10.1109/tadvp.2008.2010507
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:796-803
This work investigates electrical pressure contacts based on a micro-spring with orders of magnitude smaller pitch and force than conventional pressure contacts. The springs are beams which curl out of the surface and can be used for wafer-scale test
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f1570a322f36b0af36a12ba48814895
https://doi.org/10.1109/tcapt.2006.885959
https://doi.org/10.1109/tcapt.2006.885959
Publikováno v:
Journal of Microelectromechanical Systems. 12:989-995
Integrated high-Q coils are much sought after because they enable high-quality radio-frequency circuits that do not rely on off-chip discretes. We present a novel surface micro-machined inductor with its coil axis parallel to the substrate plane. Coi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb32925a306768f2bc24d8b09a597271
https://doi.org/10.1109/jmems.2003.820274
https://doi.org/10.1109/jmems.2003.820274
Publikováno v:
Journal of Non-Crystalline Solids. :731-735
Pulsed excimer-laser processing of amorphous silicon on glass substrates enables the fabrication of high-quality polycrystalline silicon (poly-Si) thin-film transistors. Here we describe the fabrication and testing of prototype imagers fabricated in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0aa1d80c20746a145bff325836c2ef4b
https://doi.org/10.1016/s0022-3093(01)01106-1
https://doi.org/10.1016/s0022-3093(01)01106-1
Autor:
K. Van Schuylenbergh, L. Melekhov, P. Nylen, Kanai S. Shah, J. B. Boyce, Steve E. Ready, Robert Street, Haim Hermon, Jackson Ho
Publikováno v:
Journal of Applied Physics. 91:3345-3355
The factors determining the x-ray sensitivity of HgI2 and PbI2 as direct detector materials for large area matrix addressed x-ray image sensors are described, along with a model to explain their different properties. The imaging studies are made on t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7afb84157766c54f9fbf4a53de04fc1
https://doi.org/10.1063/1.1436298
https://doi.org/10.1063/1.1436298
Autor:
Daniele C. Boils-Boissier, Jurgen H. Daniel, Marcelo Mulato, K. Van Schuylenbergh, Raj B. Apte, Brent S. Krusor, T. Do, Robert Street, Peter M. Kazmaier, Rachel Lau, Adela Goredema
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 19:1219-1223
Micromachining has potential applications for large area image sensors and displays, but conventional micro-electro-mechanical system (MEMS) technology based on crystalline silicon wafers cannot be used. Instead, large area devices use deposited film
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::806a4f591348743eaed3a5a6f8183d30
https://doi.org/10.1116/1.1380226
https://doi.org/10.1116/1.1380226
Publikováno v:
Journal of Applied Physics. 89:8193-8201
Studies are reported of the image-blur effects caused by lateral crosstalk between neighboring pixels of large-area amorphous silicon (a-Si:H) image sensors. Data are obtained from high fill factor sensor arrays using 512×512 pixels of 75 μm size a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43b361dbdd6cb79e3b1eb0f05911ef18
https://doi.org/10.1063/1.1370111
https://doi.org/10.1063/1.1370111
Autor:
R. A. Street, J. B. Boyce, R. T. Fulks, JengPing Lu, Y. Wang, Ping Mei, R. Lau, K. Van Schuylenbergh, Jackson Ho
Publikováno v:
Thin Solid Films. 383:137-142
Pulsed excimer-laser processing of amorphous silicon on non-crystalline substrates allows for the fabrication of high-quality polysilicon materials and thin-film transistors (TFTs). Under optimized processing conditions, these polysilicon TFTs have h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce99573477539ef5b7d10625841d34ec
https://doi.org/10.1016/s0040-6090(00)01585-6
https://doi.org/10.1016/s0040-6090(00)01585-6
Publikováno v:
Applied Physics Letters. 80:4656-4658
We report here the realization of a large-area compatible, flat panel imager with pixel level amplifiers. The imager is based on excimer-laser crystallized, polycrystalline silicon (poly-Si) thin-film transistors. By incorporating pixel level amplifi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c16a96484286a20d0bc945dd8433d6b3
https://doi.org/10.1063/1.1481788
https://doi.org/10.1063/1.1481788
Autor:
K. Van Schuylenbergh, Robert Puers
Publikováno v:
Scopus-Elsevier
Inductive powering of implantable monitoring devices is a widely accepted solution to replace implanted batteries. However, this method demands technically skilled operators to constantly tune the power link parameters. This becomes particularly impo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4a19776e17846a9274a6da7f8a6a9e1
https://doi.org/10.1109/sensor.1995.717082
https://doi.org/10.1109/sensor.1995.717082