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pro vyhledávání: '"K. V. Boon"'
Publikováno v:
2013 IEEE International Conference on Solid Dielectrics (ICSD).
Metallic impurities and voids are supposed to be two main reasons for dielectric breakdown of polymeric insulation in High-Voltage applications. In this paper we address the question which of the two defect types has more severe consequences on insul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e43be644751cc06989d086c57ee6f51d
https://doi.org/10.1109/icsd.2013.6619773
https://doi.org/10.1109/icsd.2013.6619773
