Zobrazeno 1 - 3
of 3
pro vyhledávání: '"K. T. Heng"'
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
In this paper, a combined random vibration and thermal cycling fatigue time-to-failure (TTF) prediction analysis will be reported. The combined random vibration and thermal cycling (TC) loading profile employed in the study is a thermal cycle loading
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ea97c13fa830c5bf01643328a871c02
https://doi.org/10.1109/ectc.2013.6575740
https://doi.org/10.1109/ectc.2013.6575740
Publikováno v:
Journal of Heat Transfer. 100:382-384
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07fd6ce1d1abeac4939a8960e7698c9e
https://doi.org/10.1115/1.3450819
https://doi.org/10.1115/1.3450819
Autor:
K T, Heng
Publikováno v:
The Nursing journal of Singapore. 19(1)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::d7d0783ac786799ec41b764354bb8dd9
https://pubmed.ncbi.nlm.nih.gov/258311
https://pubmed.ncbi.nlm.nih.gov/258311