Zobrazeno 1 - 10
of 42
pro vyhledávání: '"K. T. Heng"'
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
In this paper, a combined random vibration and thermal cycling fatigue time-to-failure (TTF) prediction analysis will be reported. The combined random vibration and thermal cycling (TC) loading profile employed in the study is a thermal cycle loading
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ea97c13fa830c5bf01643328a871c02
https://doi.org/10.1109/ectc.2013.6575740
https://doi.org/10.1109/ectc.2013.6575740
Publikováno v:
Journal of Heat Transfer. 100:382-384
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07fd6ce1d1abeac4939a8960e7698c9e
https://doi.org/10.1115/1.3450819
https://doi.org/10.1115/1.3450819
Autor:
K T, Heng
Publikováno v:
The Nursing journal of Singapore. 19(1)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::d7d0783ac786799ec41b764354bb8dd9
https://pubmed.ncbi.nlm.nih.gov/258311
https://pubmed.ncbi.nlm.nih.gov/258311
Autor:
Ozcelikay, Goksu1 (AUTHOR), Karadurmus, Leyla1,2 (AUTHOR), Kaya, S. Irem1 (AUTHOR), Bakirhan, Nurgul K.3 (AUTHOR) nurgulk44@gmail.com, Ozkan, Sibel A.1 (AUTHOR) sibel.ozkan@pharmacy.ankara.edu.tr
Publikováno v:
Critical Reviews in Analytical Chemistry. 2020, Vol. 50 Issue 3, p212-225. 14p.
Autor:
Tymen, G.1 gwenc-hlan.tymen@etu.univ-nantes.fr, Allanic, N.1, Sarda, A.1, Mousseau, P.1, Plot, C.1, Madec, Y.1, Caltagirone, J.P.2
Publikováno v:
Experimental Heat Transfer. 2018, Vol. 31 Issue 4, p317-333. 17p. 1 Color Photograph, 7 Diagrams, 3 Charts, 9 Graphs.
Autor:
Matos-Trujillo, Madyu1 madyu.matos@umcc.cu, Díaz-Solares, Maykelis2, Samaniego-Fernández, Luz María1, Cortegaza-Ávila, Leydis3, Pérez-Milian, José R.3, Pellón-Guzmán, Yenima3, Rufín-Hernández, Yordanka3, Pérez-Pérez, Josel3
Publikováno v:
Pastos y Forrajes. jul-sep2017, Vol. 40 Issue 3, p195-200. 6p.
Publikováno v:
World Journal of Urology; Aug2021, Vol. 39 Issue 8, p2831-2841, 11p
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jan2021, Vol. 11 Issue 1, p43-50, 8p
Publikováno v:
Experimental Heat Transfer. Apr1995, Vol. 8 Issue 2, p97-117. 21p.
Publikováno v:
Journal of Electronic Materials; Nov2018, Vol. 47 Issue 11, p6781-6790, 10p, 4 Diagrams, 3 Charts, 7 Graphs