Zobrazeno 1 - 10
of 10
pro vyhledávání: '"K. R. Grebe"'
Autor:
K. R. Grebenyuk, O. M. Denisova, I. O. Zhukova, O. M. Bobrytska, L. A. Vodopianova, N. I. Hladka, T. I. Yakymenko, V. O. Prykhodchenko
Publikováno v:
Науковий вісник Львівського національного університету ветеринарної медицини та біотехнологій імені С.З. Ґжицького: Серія Ветеринарні науки, Vol 25, Iss 110, Pp 76-81 (2023)
Diseases of the urinary system of various etiologies are common in all species of animals and over time, they can lead to the development of chronic kidney disease (CKD) as the progressive process in which renal function gradually decreases over seve
Externí odkaz:
https://doaj.org/article/d1930df3629a4367b6d344a710198b7e
Autor:
J. T. C. Yeh, K. R. Grebe
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 1:604-608
Poly‐para‐xylylene family thin films deposited by vapor phase polymerization are pin hole free and are chemically inert to most acids, alkalies, and organic solvents. These properties make this material very attractive as a passivation agent on t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f506325d5fc0f6e74bc0091042c25464
https://doi.org/10.1116/1.571967
https://doi.org/10.1116/1.571967
Publikováno v:
Journal of Vacuum Science and Technology. 20:359-363
Solders of various compositions are used in the electronics industry to interconnect components. To obtain proper reflow of the solder pads to be joined, surface oxides must be removed using an appropriate chemical flux. In this paper, we describe an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e1053cafb3b46922751dde0b539d8fb
https://doi.org/10.1116/1.571464
https://doi.org/10.1116/1.571464
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 2:1292-1295
Magnetic field enhanced reactive ion etching of polyimide was investigated using a planar magnetron discharge. Etch studies were conducted with various gas composition, power, and pressure conditions. Etch rates of fully cured polyimide up to 2.5 μm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d571d973c5825f94c6230bd95bc69c13
https://doi.org/10.1116/1.572397
https://doi.org/10.1116/1.572397
Autor:
J.W. Stasiak, J. Sokolowski, M. Natan, S. P. Klepner, R.W. Guernsey, C.J. Anderson, S. Puroshothaman, Run-Han Wang, C.T. Wu, D. J. Herrell, H. C. Jones, J. H. Greiner, J. Matisoo, P. Geldermans, Paul A. Moskowitz, D.P. Walkman, T.R. Gheewala, K. R. Grebe, M. Klein, B. J. C. van der Hoeven, S. Bermon, A. J. Warnecke, T. Yogi, Harry R. Bickford, P. C. Arnett, Mark B. Ketchen, A.A. Bright
Publikováno v:
IEEE Electron Device Letters. 2:262-265
This letter describes the first system level test vehicle in Josephson technology. The experiment consists of four circuit chips assembled on two cards in a high density, 3-dimensional, card-on-board package. A data path, which is representative of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1357bd409d138f590966180a5f77b52f
https://doi.org/10.1109/edl.1981.25426
https://doi.org/10.1109/edl.1981.25426
Autor:
D. Waldman, S. Purushothaman, K. R. Grebe, Run-Han Wang, J. Sokolowski, T. Yogi, Harry R. Bickford, C.T. Wu, P. Geldermans, M. Natan, M. Palmer, Paul A. Moskowitz, B. J. C. van der Hoeven, S. Lahiri
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 5:271-280
Packaging technology used to build the first system crosssection test vehicle in Josephson technology is described. A threedimensional modular card-on-board packaging approach has been selected to fabricate the test vehicle which incorporates all the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc12e91d6b4be1762a40fb350b20591d
https://doi.org/10.1109/tchmt.1982.1135958
https://doi.org/10.1109/tchmt.1982.1135958
Publikováno v:
IBM Journal of Research and Development. 8:170-176
This paper describes a technique for the batch fabrication of ferrite memory arrays in which wire, previously coated with a thermoplastic, is formed into two orthogonally disposed sets of parallel wires. These grids are oriented between opposingm old
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::249cb0dc7ba21e8d95b953ecd70a9a50
https://doi.org/10.1147/rd.82.0170
https://doi.org/10.1147/rd.82.0170
Autor:
K. R. Grebe, H. H. Zappe
Publikováno v:
Journal of Applied Physics. 44:865-874
Transitions from the zero‐voltage to the voltage state have been directly measured on large (≃104 μm2) Josephson junctions. By adjusting the current load, the switching times (10–90%) were varied from 60 to 400 psec. Good agreement was found b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a49e23e46e3ebc835d8b5b6e17edf0c7
https://doi.org/10.1063/1.1662274
https://doi.org/10.1063/1.1662274
Autor:
J. M. Brownlow, K. R. Grebe
Publikováno v:
Journal of Applied Physics. 38:1190-1191
Several performance advantages can be realized in ferrite memory cores by reducing the aperture size and the diameter ratio. Advantages which can be obtained are: lower drive currents, wider operating margins, lower back voltage, and greater packing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2062d3713c6477f960582fcd622b5d4
https://doi.org/10.1063/1.1709534
https://doi.org/10.1063/1.1709534
Autor:
John M. Baker, A. J. Warnecke, S. P. Klepner, M. J. Palmer, K. R. Grebe, G. R. Proto, J. H. Magerlein
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 2:636
Several types of thin dielectric films which can be deposited on substrates held near room temperature have been tested for use as insulators in integrated circuit structures. The types of insulation studied include single and double layer SiO films,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd947a3091ca19db3907f0001e9cb055
https://doi.org/10.1116/1.582854
https://doi.org/10.1116/1.582854