Zobrazeno 1 - 10
of 33
pro vyhledávání: '"K. Nagarkar"'
Publikováno v:
2019 3rd International Conference on Trends in Electronics and Informatics (ICOEI).
In today's world, the farmer plays a vital role by working hard in the fields and growing the crops for the people that are living their life in various places for earning their basic necessities. In India use of pesticides is 76% as against the worl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7bed5a8cea336bb52dfbbb50986d9ed9
https://doi.org/10.1109/icoei.2019.8862729
https://doi.org/10.1109/icoei.2019.8862729
Autor:
Sara Naomi Paisner, Krishnaswami Srihari, G. Strosaker, K. Nagarkar, A. Acharya, Paulo Meneghetti, Sandeep Tonapi, Arun Virupaksha Gowda, P. Hans
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Highly efficient thermal interface materials (TIMs) have become necessary to effectively manage the increasing heat generated at the silicon level with every new generation of microprocessors. Typically, TIMs consist of polymers that are highly loade
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80255e28f457e3250b59d2c7cfd1a5d5
https://doi.org/10.1109/eptc.2005.1614487
https://doi.org/10.1109/eptc.2005.1614487
Publikováno v:
Proceedings of the 2004 Winter Simulation Conference, 2004..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97eefdb0512cec4149b1e1e4b70ca9c8
https://doi.org/10.1109/wsc.2004.1371565
https://doi.org/10.1109/wsc.2004.1371565
Autor:
David Richard Esler, K. Nagarkar, Arun Virupaksha Gowda, Sandeep Tonapi, Krishnaswami Srihari, Sara Naomi Paisner
Publikováno v:
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..
Thermal interface materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). Thermal grease
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::357d4b99cf0efe354e6703b98881a95c
https://doi.org/10.1109/stherm.2005.1412160
https://doi.org/10.1109/stherm.2005.1412160
Autor:
David Richard Esler, Arun Virupaksha Gowda, Sandeep Tonapi, Krishnaswami Srihari, K. Nagarkar
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
One of the key challenges in the thermal management of microelectronic devices is interfaces such as those between the chip and heat spreader and between the heat spreader and heat sink or cold plate. Typically, thermal interfaces are filled with mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15252815897956dc6574967635d91599
https://doi.org/10.1109/eptc.2004.1396574
https://doi.org/10.1109/eptc.2004.1396574
Publikováno v:
The Journal of the Association of Physicians of India. 44(11)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::40e9911dfbb2d468016b9900e9b5ca08
https://pubmed.ncbi.nlm.nih.gov/9251462
https://pubmed.ncbi.nlm.nih.gov/9251462
Autor:
A B, Dey, K, Nagarkar
Publikováno v:
Tropical gastroenterology : official journal of the Digestive Diseases Foundation. 16(2)
The prevalence of multi-drug resistant tuberculosis is increasing globally which has upset tuberculosis treatment and control programmes. The problem has been further complicated by co-infection with HIV virus. Treatment of multi drug resistant tuber
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::b21d69fef77f68e08184ec103b8c05f1
https://pubmed.ncbi.nlm.nih.gov/8644369
https://pubmed.ncbi.nlm.nih.gov/8644369
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