Zobrazeno 1 - 10
of 31
pro vyhledávání: '"K. Kivilahti"'
Publikováno v:
Computational Materials Science. 50:690-697
In the present study, an algorithm, combining the Potts model based Monte Carlo (MC) and finite element methods, is developed in order to predict the dynamic recrystallization of tin in tin-rich lead-free solder interconnections during thermal cyclin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::721988e4c16bdc6f4b590d3d99769fb7
https://doi.org/10.1016/j.commatsci.2010.09.035
https://doi.org/10.1016/j.commatsci.2010.09.035
Publikováno v:
Chemistry of Materials. 17:2223-2226
Cross-sectional SEM-BSE image of the Sn−3.5%Ag−0.5%Cu solder interface showing a high magnification microstructure of the rapid variation of the thick and thin IMC layer.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::314481e11ab09c704a912720d6dd0019
https://doi.org/10.1021/cm0478069
https://doi.org/10.1021/cm0478069
Publikováno v:
Laurila, T, Zeng, K, Kivilahti, J K, Molarius, J & Suni, I 2002, ' TaC as a diffusion barrier between Si and Cu ', Journal of Applied Physics, vol. 91, no. 8, pp. 5391-5399 . https://doi.org/10.1063/1.1464652
The reaction mechanisms and related microstructures in the Si/TaC/Cu metallization system have been studied experimentally and theoretically by utilizing ternary Si-Ta-C and Ta-C-Cu phase diagrams as well as activity diagrams calculated at 800 °C. W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f73e7569e56ed83a05de68cdcfed7b9
https://doi.org/10.1063/1.1464652
https://doi.org/10.1063/1.1464652
Publikováno v:
Laurila, T, Zeng, K, Molarius, J, Riekkinen, T, Suni, I & Kivilahti, J K 2002, ' Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems ', Microelectronic Engineering, vol. 64, no. 1-4, pp. 279-287 . https://doi.org/10.1016/S0167-9317(02)00800-6
The effect of oxygen on the reactions in the Si/Ta/Cu and Si/TaC/Cu metallization systems was investigated by utilizing the assessed Ta–O binary and the evaluated ternary Ta–C–O phase diagrams together with detailed transmission electron micros
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b55fdee16aec824f5ae5b06f2db39b3c
https://doi.org/10.1016/S0167-9317(02)00800-6
https://doi.org/10.1016/S0167-9317(02)00800-6
Publikováno v:
Journal of Applied Physics. 89:4843-4849
The reaction kinetics of eutectic SnPb solder on Cu were studied and compared in the liquid state at 200 to 240 °C and in the solid state aged at 125–170 °C. The ternary phase diagrams of SnPbCu, the morphology of intermetallic compound (IMC), an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c185d6e514f582e435c119911a3fc5bf
https://doi.org/10.1063/1.1357469
https://doi.org/10.1063/1.1357469
Publikováno v:
IEEE Transactions on Advanced Packaging. 24:515-520
To decrease the bonding temperature required for eutectic SnAg solder, SnAg solder bumps were chemically coated with a pure Bi layer. During heating, a low melting eutectic forms between the Bi coating and the SnAg, enabling bonding at temperatures b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68e299572a8272b47723caf125937aae
https://doi.org/10.1109/6040.982838
https://doi.org/10.1109/6040.982838
Publikováno v:
Laurila, T, Zeng, K, Kivilahti, J, Molarius, J & Suni, I 2001, ' Effect of Oxygen on the reactions in the Si/Ta/Cu metallization system ', Journal of Materials Research, vol. 16, no. 10, pp. 2929-2946 . https://doi.org/10.1557/JMR.2001.0404
The effect of oxygen on the reaction mechanisms in the Si/Ta/Cu metallization system was studied experimentally and by utilizing the thermodynamically assessed Ta–O binary system. It was presented that an interfacial tantalum oxide was formed betwe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48b42f6dc062263fa47b4fc6ec2528ca
https://doi.org/10.1557/JMR.2001.0404
https://doi.org/10.1557/JMR.2001.0404
Autor:
K. Heinonen, K. Kivilahti, Hannu Saloniemi, R. Pösö, Mikko Tuori, L.-A. Lindberg, Liisa Syrjälä-Qvist, Alem Tsehai Tesfa, T. Saukko
Publikováno v:
Animal Feed Science and Technology. 76:275-295
Animal performances were monitored in 30 Friesean dry cows (18 multiparous, MP-cows and 12 primiparous, PP-cows) starting six weeks before calving to eight weeks after calving. The cows were kept indoors and fed individually with a prepartum diet con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af41440572af083e2616aa94aa7e726d
https://doi.org/10.1016/s0377-8401(98)00221-1
https://doi.org/10.1016/s0377-8401(98)00221-1
Autor:
Kari Kulojärvi, Jorma K. Kivilahti
Publikováno v:
Microelectronics International. 15:16-19
A new under bump metallurgy (UBM) solution consisting of the TiW‐, Au‐ and Ni‐layers for solder flip chip applications has been developed. The metallurgy, being based on the well‐known TAB metallisation procedure, was modified by producing th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eae4f58c15d848712b76a4dc34a5393
https://doi.org/10.1108/13565369810370328
https://doi.org/10.1108/13565369810370328
Publikováno v:
Microelectronics International. 15:20-24
The dissolution processes and subsequent intermetallic reactions between high tin solder bump alloys and Cu‐ or Ni‐based UBM‐metallisations were investigated both theoretically and experimentally. The results showed that when the Cu UBM layer i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fa43f2b7231f8317e3cf3fc43b64934
https://doi.org/10.1108/13565369810215582
https://doi.org/10.1108/13565369810215582