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of 832
pro vyhledávání: '"K. Kata"'
This article focuses on a study in which feminist new materialist and arts-based methodologies were employed to explore how three girls address their experiences of sexual harassment as part of ‘crushes’ with boys in fourth and fifth grade. The s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2423::d07e0135e4ace0b5e710520f62477388
http://urn.fi/urn:nbn:fi-fe2023030629961
http://urn.fi/urn:nbn:fi-fe2023030629961
Autor:
Huuki, T. (Tuija), Kyrölä, K. (Kata)
In this article, we examine the immensely popular animated Disney film Frozen 2 (2019) through its potential as decolonial queer pedagogy. Drawing on Indigenous educational studies, queer and feminist Indigenous theories, and research on affect and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2423::9cde8e528e1e24afae2bfd9132f65658
http://urn.fi/urn:nbn:fi-fe2022102863751
http://urn.fi/urn:nbn:fi-fe2022102863751
Autor:
Leroy C. Kahre
Publikováno v:
Chemischer Informationsdienst. 6
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9663b820aee861f823c826007a675b17
https://doi.org/10.1002/chin.197551089
https://doi.org/10.1002/chin.197551089
Akademický článek
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Autor:
Zhang, Xinchao1,2 (AUTHOR), Jing, Fenglian3 (AUTHOR), Hu, Yujing2 (AUTHOR), Tian, Congna1,2 (AUTHOR), Zhang, Jianyang1,4 (AUTHOR), Li, Shuheng1,5 (AUTHOR), Wei, Qiang2 (AUTHOR), Li, Kang2 (AUTHOR), Zheng, Lu2 (AUTHOR), Liu, Jiale1,2 (AUTHOR), Zhang, Jingjie2 (AUTHOR), Bian, Yanzhu1,2 (AUTHOR) heyixue8144@126.com
Publikováno v:
EJNMMI Research. 11/13/2024, Vol. 14 Issue 1, p1-10. 10p.
Autor:
Y. Kyogoku, K. Kata, Masami Hane, Yoshihiro Hayashi, H. Honda, J. Kawahara, Fuminori Ito, Ippei Kume
Publikováno v:
2013 IEEE International Interconnect Technology Conference - IITC.
A model-base prediction method is proposed for delamination/cracking failures in Low-k/Cu interconnects with Pb-free FCBGA (Flip Chip-Ball Grid Array). The low-k failure under the solder bump, so called as a white bump (WB) failure, is caused by larg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f50df1aa5d6a64b79a434916cc987b62
https://doi.org/10.1109/iitc.2013.6615560
https://doi.org/10.1109/iitc.2013.6615560
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:448-451
A discussion is presented of the development of a low dielectric constant glass-ceramic material system with a thermal expansion coefficient and flexural strength that could be further improved. This system consists of quartz glass, cordierite, and b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a8381a40b6f2e755ba73fea1d02a9961
https://doi.org/10.1109/33.56183
https://doi.org/10.1109/33.56183
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
A molded fine-pitch ball grid array (FPBGA) structure, consisting of the fabricated chip, carrier tape, molded resin, and solder bumps, has many advantages over conventional structures for chip-scale packages. The assembly process of FPBGA consists o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61ccae3342363e625938fab40b5d4c56
https://doi.org/10.1109/ectc.1996.517465
https://doi.org/10.1109/ectc.1996.517465
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
One way to provide the ultimate shrinkage, required for the fabricating of small, lightweight, and high-performance electrical devices is by using chip-scale packaging. We have therefore developed an original chip-scale package called fine-pitch BGA
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c2ee0fb36fb980dca48dca95c12a74
https://doi.org/10.1109/ectc.1995.514387
https://doi.org/10.1109/ectc.1995.514387
Autor:
Isni, Khoiriyah1 khoiriyah.isni@ikm.uad.ac.id, Laily, Silvia Nur1, Auliya, Iffah1, Widyapuspita, Tiara1, Aziziah, Erviana Nur1, Solikhin, Mukhamat1, Wahyudi, Muhamad Fikri1
Publikováno v:
Darmabakti Cendekia: Journal of Community Service & Engagements. Jun2024, Vol. 6 Issue 1, p50-56. 7p.