Zobrazeno 1 - 2
of 2
pro vyhledávání: '"K. K. Jinka"'
Publikováno v:
Microelectronics Reliability. 49:523-529
Wire-bonded chip-on-board (CoB) multi chip modules consist of die and bond wires that are encapsulated to protect them from mechanical and chemical damage. This paper describes a rapid-assessment model for the prediction of thermomechanical strains d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36ba65ed062fe3d058ffd12a9748d58c
https://doi.org/10.1016/j.microrel.2009.02.008
https://doi.org/10.1016/j.microrel.2009.02.008
Publikováno v:
Microelectronics Reliability. 47:1246-1250
An analytical model based on elastic strain energy minimization is developed for estimating the wire profile in unencapsulated ball-wedge wire bond configuration for chip-on-board (CoB) technology. The wire profile is applicable to ball-wedge bonds w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4188ac0cf557b8ea3934668c0173dec
https://doi.org/10.1016/j.microrel.2006.08.019
https://doi.org/10.1016/j.microrel.2006.08.019