Zobrazeno 1 - 10
of 25
pro vyhledávání: '"K. J. Lau"'
Autor:
K. H. Lim, K. Jasvindar, S. M. Cheong, B. K. Ho, H. L. Lim, C. H. Teh, K. J. Lau, A. Suthahar, D. Ambigga
Publikováno v:
Tobacco Induced Diseases, Vol 14, Iss March (2016)
Introduction The determination of smoking prevalence and its associated factors among the elderly could provide evidence-based findings to guide the planning and implementation of policy in order to will help in reducing the morbidity and mortality o
Externí odkaz:
https://doaj.org/article/c3a86ee11f404c9482f9fb8db1850388
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1195:012025
Palm oil mill effluent (POME) has become a serious problem for the oil palm industries because of its high organic contents and other contaminant formation that results in dark colour, turbid and unpleasant odour. In the conventional treatment of POM
Autor:
D. Ambigga, Kuang Hock Lim, K. Jasvindar, S. M. Cheong, C. H. Teh, H. L. Lim, K. J. Lau, B. K. Ho, A. Suthahar
Publikováno v:
Tobacco Induced Diseases, Vol 14, Iss March (2016)
Tobacco Induced Diseases
Tobacco Induced Diseases
Introduction The determination of smoking prevalence and its associated factors among the elderly could provide evidence-based findings to guide the planning and implementation of policy in order to will help in reducing the morbidity and mortality o
Publikováno v:
International Journal of Fracture. 130:617-634
A microscopic investigation has been made on the shearing of one leaded and two lead-free solders by using an in situ SEM method. A shear lap joint specimen is designed and fabricated to accommodate a thin layer of solder alloy between copper strips.
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 218:909-920
A unified viscoplastic constitutive model for the fatigue life prediction of solder alloy 63Sn-37Pb is presented. The model incorporates the strain rate effect, the creep-plastic interaction and the dwell time effect under cyclic strain and stress lo
Publikováno v:
Journal of Electronic Packaging. 126:367-373
This paper presents an investigation of lead-free Sn-Ag base alloy, 95.5Sn-3.9Ag-0.6Cu, both experimentally and analytically. Experimentally, the deformation behavior of the material was measured for different temperatures (25°C and 1000°C) over a
Publikováno v:
Journal of Electronic Packaging. 126:148-158
In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is develo
Publikováno v:
International Journal of Damage Mechanics. 12:225-243
A damage coupling viscoplastic model is developed to predict fatigue life of solder alloy 63Sn-37Pb under stress control. The viscoplastic flow rule chosen employs a hyperbolic sine function. A damage evolution equation is formulated based on three d
Publikováno v:
Journal of Manufacturing Science and Engineering. 125:120-127
Fixturing plays an important role in the quality of metal fit-up for sheet metal assembly with laser welding. To reduce the sensitivity of the designed fixture configuration to location fluctuation, this paper provides a quality design of the fixture
Publikováno v:
International Journal of Fracture. 118:25-30
A four-point bend specimen is being considered for the study of cracks initially close to and parallel to the interface of two dissimilar materials. Finite element analysis is employed to determine specimen configurations that produce constant stress