Zobrazeno 1 - 10
of 19
pro vyhledávání: '"K. J. Kozaczek"'
Publikováno v:
Microelectronic Engineering. 83:2208-2212
Crystallographic texture of copper in interconnect trenches after anneal and planarization has been mapped across 200mm wafers by means of X-ray diffraction (XRD). Texture in trenches 70nm and 100nm wide with aspect ratios of 2-2.5 was found to have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac53c513e8757d3a17613068a3637ac1
https://doi.org/10.1016/j.mee.2006.10.005
https://doi.org/10.1016/j.mee.2006.10.005
Publikováno v:
Modelling and Simulation in Materials Science and Engineering. 3:829-843
Elastic stresses in the grain boundary regions caused by the mismatch between the elastic properties of a carbide precipitate and a nickel alloy matrix were studied by finite-element modelling. The effects of the metal matrix elastic anisotropy, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::400c323830bac4754774cf2037f7b069
https://doi.org/10.1088/0965-0393/3/6/006
https://doi.org/10.1088/0965-0393/3/6/006
Publikováno v:
Journal of Materials Science. 30:2390-2400
The stress distribution in a random polycrystalline material (Alloy 600) was studied using a topologically correct microstructural model. The distributions of von Mises and hydrostatic stresses, which could be important factors when studying the inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12db0c53d5ea28c50f76eb0990db54eb
https://doi.org/10.1007/bf01184591
https://doi.org/10.1007/bf01184591
Autor:
Camden R. Hubbard, T. R. Watkins, K. J. Kozaczek, Benjamin Ballard, Paul Predecki, D. N. Braski
Publikováno v:
Advances in X-ray Analysis. 39:363-370
Depth profiles of intrinsic in-plane, biaxial stresses were obtained as a function of τ, the 1/e penetration depth, in a 1.0 um thick planar d. c. magentron sputter deposited molybdenum film using asymmetric grazing incidence x-ray diffraction (GIXD
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5f949dd7130d36ce884a799b1c87aad
https://doi.org/10.1154/s0376030800022771
https://doi.org/10.1154/s0376030800022771
Publikováno v:
Journal of Nondestructive Evaluation. 12:79-95
Effect of processing parameters including cold work and grain size on texture development in copper and 68:32 α-brass thin sheets is investigated. The preferred orientation of grains (texture) is represented quantitatively by the orientation distrib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49312cb23ac4e251659e41798ade045e
https://doi.org/10.1007/bf00565911
https://doi.org/10.1007/bf00565911
Publikováno v:
Journal of Nondestructive Evaluation. 12:97-107
The on-line prediction of metal sheet formability requires that both material characterization (texture identification) and yield loci predetermination be done in very shor time intervals. Of two applicable approaches, i.e., continuum mechanics and c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad7a1ce66fd69d147ff1c13faeb00437
https://doi.org/10.1007/bf00565912
https://doi.org/10.1007/bf00565912
Publikováno v:
Journal of Materials Science. 27:5174-5180
The effectiveness of ultrasonic velocity measurements was evaluated as a means for nondestructive characterization of cold-rolled copper and 68:32 brass sheets. An apparatus was designed to generate and receive the zeroth symmetrical mode of ultrason
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19bb9d937849298141108be227448748
https://doi.org/10.1007/bf02403813
https://doi.org/10.1007/bf02403813
Publikováno v:
AIP Conference Proceedings.
The rapid adoption of damascene copper processing has brought about an increased need to understand and control microstructure in the barrier, seed and electroplated copper layers during manufacture. We have developed a fully automated metrology tool
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bd90e8bef486d3aca75e706b67b6b7e
https://doi.org/10.1063/1.1622516
https://doi.org/10.1063/1.1622516
Publikováno v:
AIP Conference Proceedings.
The recrystallization kinetics of electroplated copper at room temperature was studied with a novel X‐ray diffraction (XRD) metrology tool. The relaxation of short‐range strains, grain growth, and the evolution of crystallographic texture (prefer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::debc5125b937cbca6d61b9dae766b192
https://doi.org/10.1063/1.1622515
https://doi.org/10.1063/1.1622515
Autor:
Patrick W. DeHaven, D. S. Kurtz, K. J. Kozaczek, R. I. Martin, P. R. Moran, Kenneth P. Rodbell, Sandra G. Malhotra
Publikováno v:
MRS Proceedings. 721
The rapid adoption of damascene copper technology has brought about an increased need to understand and control microstructure in the barrier and metal layers during processing. We have developed and implemented a methodology for rapidly characterizi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02b10afd6776d82ea48d09c9672c6ee9
https://doi.org/10.1557/proc-721-j1.1
https://doi.org/10.1557/proc-721-j1.1