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Publikováno v:
2020 International Conference Mechatronic Systems and Materials (MSM).
In this paper we present the results of our research on the effectiveness of data exchange between the reader and the label in an RFID system in various environment configurations. Discussed technology is particularly useful in metal cabinets intende
Publikováno v:
ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA. 1:73-76
Publikováno v:
Circuit World. 43:9-12
Purpose This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink. Design/methodology/approach Fully inkjet-printed conductive circui
Autor:
Wojciech Stęplewski, K. Futera, K. Lipiec, M. Kościelski, Tomasz Serzysko, Janusz Sitek, A. Araźna, Kamil Janeczek
Publikováno v:
ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA. 1:105-110
Publikováno v:
Microelectronics International. 33:94-101
Purpose The aim of this paper is to present non-destructive and destructive methods of failure analysis of epoxy moulded IC packages on the example of power MOSFETs in SOT-227 package. Design/methodology/approach A power MOSFET in SOT-227 package was
Efficient Inkjet Printing of Graphene-Based Elements: Influence of Dispersing Agent on Ink Viscosity
Autor:
Aneta Arazna, Marcin Słoma, Konrad Kielbasinski, Andrzej Skalski, K. Futera, Daniel Janczak, Małgorzata Jakubowska, Lucja Dybowska-Sarapuk
Publikováno v:
Nanomaterials
Volume 8
Issue 8
Nanomaterials, Vol 8, Iss 8, p 602 (2018)
Volume 8
Issue 8
Nanomaterials, Vol 8, Iss 8, p 602 (2018)
Inkjet printing is an excellent printing technique and an attractive alternative to conventional technologies for the production of flexible, low-cost microelectronic devices. Among many parameters that have a significant impact on the correctness of
Publikováno v:
Circuit World. 41:121-124
Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins
Autor:
Janusz Sitek, Wojciech Stęplewski, Piotr Ciszewski, Kamil Janeczek, A. Araźna, K. Futera, K. Lipiec
Publikováno v:
Soldering & Surface Mount Technology. 27:120-124
Purpose – The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated thermal cycling. Design/methodology/approach – Solder joints of diodes and resistors
Publikováno v:
Soldering & Surface Mount Technology. 27:108-111
Purpose – The purpose of this paper is to report surface properties of treated Teonex Du Pont polyethylene naphthalate (PEN) foil substrates. Design/methodology/approach – There were three different cleaning treatments among other: argon glow dis