Recent Advances in Flexible Temperature Sensors: Materials, Mechanism, Fabrication, and Applications.

Autor: Liu, Lin^1,2 (AUTHOR), Dou, Yingying¹ (AUTHOR), Wang, Junhua¹ (AUTHOR), Zhao, Yan¹ (AUTHOR), Kong, Wenwen¹ (AUTHOR), Ma, Chaoyan¹ (AUTHOR) macy@ms.xjb.ac.cn, He, Donglin¹ (AUTHOR), Wang, Hongguang¹ (AUTHOR), Zhang, Huimin¹ (AUTHOR) zhanghm@ms.xjb.ac.cn, Chang, Aimin¹ (AUTHOR) changam@ms.xjb.ac.cn, Zhao, Pengjun¹ (AUTHOR) zhaopj@ms.xjb.ac.cn

Publikováno v: Advanced Science. 9/25/2024, Vol. 11 Issue 36, p1-33. 33p.

Photoprogrammed Multifunctional Optoelectronic Synaptic Transistor Arrays Based on Photosensitive Polymer‐Sorted Semiconducting Single‐Walled Carbon Nanotubes for Image Recognition.

Autor: Sui, Nianzi^1,2 (AUTHOR), Ji, Yixi³ (AUTHOR), Li, Min^1,2 (AUTHOR), Zheng, Fanyuan⁴ (AUTHOR), Shao, Shuangshuang^1,2 (AUTHOR), Li, Jiaqi^1,2 (AUTHOR), Liu, Zhaoxin³ (AUTHOR), Wu, Jinjian³ (AUTHOR) jinjian.wu@mail.xidian.edu.cn, Zhao, Jianwen^1,2 (AUTHOR) jwzhao2011@sinano.ac.cn, Li, Lain‐Jong⁴ (AUTHOR) lanceli1@hku.hk

Publikováno v: Advanced Science. 8/7/2024, Vol. 11 Issue 29, p1-12. 12p.

(Invited) Light Emission from Highly-Strained Germanium for On-Chip Optical Interconnects

Autor: D. Nam, D. S. Sukhdeo, B. R. Dutt, K. C. Saraswat

Publikováno v: ECS Meeting Abstracts. :1796-1796

The relentless device scaling paradigm is being threatened by the limits of Cu-based interconnects including excessive power dissipation, insufficient communication bandwidth, and signal latency. Many of these limitations are caused by the increase i

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::80a8e21d5c4d7ab23d3f4059c3fcae9e
https://doi.org/10.1149/ma2014-02/35/1796

Van der Waals Heterostructures for Photoelectric, Memory, and Neural Network Applications.

Autor: Xu, Hang¹ (AUTHOR), Xue, Yue^1,2 (AUTHOR), Liu, Zhenqi^1,3 (AUTHOR), Tang, Qing¹ (AUTHOR), Wang, Tianyi² (AUTHOR), Gao, Xichan² (AUTHOR), Qi, Yaping^2,4 (AUTHOR) qi.yaping.a2@tohoku.ac.jp, Chen, Yong P.^2,4,5,6 (AUTHOR) yongchen@purdue.edu, Ma, Chunlan¹ (AUTHOR) wlxmcl@mail.usts.edu.cn, Jiang, Yucheng¹ (AUTHOR) jyc@usts.edu.cn

Publikováno v: Small Science. Apr2024, Vol. 4 Issue 4, p1-45. 45p.

Design of Versatile Top‐Down Transfer by Thermal Release Tape/Poly(methyl methacrylate) (TRT/PMMA) Bi‐Supporting Layers Toward All‐Transfer Transition Metal Dichalcogenide Material Based Transistor Arrays.

Autor: Shen, Ying-Chun^1,2,3 (AUTHOR), Wu, Bang-Kai^1,2,3,4 (AUTHOR), Tsai, Tsung-Shun^1,2,3 (AUTHOR), Liu, Mingjin^1,2,3 (AUTHOR), Chen, Jyun-Hong⁵ (AUTHOR), Yang, Tzu-Yi^1,2,3 (AUTHOR), Cyu, Ruei-Hong^1,2,3 (AUTHOR), Chen, Chieh-Ting^1,2,3 (AUTHOR), Hsu, Yu-Chieh^1,2,3 (AUTHOR), Luo, Chai-Hung^1,2,3 (AUTHOR), Huang, Yu-Qi^1,2,3 (AUTHOR), Peng, Yu-Ren^1,2,3 (AUTHOR), Shen, Chang-Hong⁵ (AUTHOR), Lin, Yen-Fu⁶ (AUTHOR), Chiu, Po-Wen^2,4 (AUTHOR), King, Ya-Chin^2,4 (AUTHOR) ycking@ee.nthu.edu.tw, Chueh, Yu-Lun^1,2,3 (AUTHOR) ylchueh@mx.nthu.edu.tw

Publikováno v: Small Science. Feb2024, Vol. 4 Issue 2, p1-13. 13p.