Výsledky vyhledávání

Halfdan 4D workflow and results leading to increased recovery

Autor: K. K. Hirsch, L. D. Vagg, M. A. Calvert, K. C. Ooi, A. R. Hoover

Publikováno v: The Leading Edge. 35:840-848

In 2012, a repeat time-lapse seismic survey was acquired over the Halfdan oil field located in the Danish North Sea. The main oil reservoir is the Cretaceous chalk Tor Formation, and the field is developed with a line-drive water flood. The reservoir

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::720227acb8f1f9d9cd9af9db6c0ead2f
https://doi.org/10.1190/tle35100840.1

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Insights into sweep efficiency using 4D seismic at Halfdan field in the North Sea

Autor: K. C. Ooi, A. R. Hoover, M. A. Calvert, K. B. Lafond, I.H. Herbert, L. D. Vagg

Publikováno v: The Leading Edge. 33:182-187

A repeat 4D seismic survey was acquired in 2012 over the Halfdan oil field in the Danish North Sea Central Graben. The main objectives were to understand the lateral and vertical waterflood sweep in the reservoir, to identify unswept areas, to guide

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::44cb8fd193858cb47f887187054d1eca
https://doi.org/10.1190/tle33020182.1

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Akademický článek

Evolution of dirofilariasis diagnostic techniques from traditional morphological analysis to molecular-based techniques: a comprehensive review.

Autor: Aththanayaka, A. M. M. T. B.¹, Dayananda, B. S. W. M. T. B.¹, Ranasinghe, H. A. K.² achinikoshilaa@gmail.com, Amarasinghe, L. D.²

Publikováno v: Frontiers in Parasitology. 2024, p1-17. 17p.

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Over pad metallization for high temperature interconnections

Autor: A. Prabhu, Y. C. How, S. Qu, S. Athavale, Luu T. Nguyen, C. S. Lee, A. Xu, K. C. Ooi, A. Poddar

Publikováno v: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Electrolytic CuNiAu over pad metallization (OPM) was qualified for high temperature gold wire bonding applications. Stability of the CuNiAu OPM metal stack was tested through extreme conditions, i.e.: ambient temperature 250 °C up to 4000 hours, wit

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4957859ede57e772921926e51ef9c3e1
https://doi.org/10.1109/ectc.2011.5898708

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Electroless over pad metallization for high temperature interconnections

Autor: S. Qu, S. Athavale, Y. C. How, A. Xu, A. Prabhu, K. C. Ooi, Ken Pham, C. S. Lee, Luu T. Nguyen, A. Poddar

Publikováno v: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

Electrolessly plated over pad metallization (OPM) was evaluated for high temperature gold wire bonding applications. Bonding strength, measured by wire bond bump shear test, of 4N gold wire on electroless OPMs, such as electroless nickel/immersion go

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::aec2634058575a6c7577bd3077569526
https://doi.org/10.1109/iemt.2010.5746709

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Recent Advances in Surfactant Remediation of Contaminated Soils

Autor: Gary A. Pope, V Dwarakanath, F. J. Holzmer, Vinitha Weerasooriya, K. C. Ooi, Richard E. Jackson

Publikováno v: All Days.

Significant advances have occurred in the application of surfactants for the remediation of soils contaminated by a wide variety of oils and chlorinated solvents. Many new laboratory and field data have become available and provide a basis for a bett

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::da77e75dd215920936d9fe049f20d89c
https://doi.org/10.2118/52732-ms

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