Zobrazeno 1 - 10
of 515
pro vyhledávání: '"K-D. Lang"'
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Tina Thomas, M. Schmied, P. Fruehauf, R. Fust, D. Schütze, Martin Schneider-Ramelow, Tanja Braun, M. Kreitmair, Steve Voges, W. Neifer, M. Heimann, S. Nerreter, K.-F. Becker, S. Gottwald, B. Schröder, A. Hofmeister, K-D. Lang, R. Blank
Publikováno v:
International Symposium on Microelectronics. 2019:000415-000422
Paper Abstract The PCB 4.0 research project offers the opportunity to take the flexibility, energy efficiency, and resource efficiency of production processes to a whole new level through intelligent control and networking. The development of electro
Autor:
Uwe Maas, Lars Boettcher, Andreas Ostmann, Manuel Seckel, Martin Schneider-Ramelow, Rolf Aschenbrenner, Stefan Kosmider, K-D. Lang, Ivan Ndip, Dionysios Manessis, Kavin Senthil Murugesan
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
This paper brings into light all the new developmental work performed in the wide domain of high frequency PCBs for the realisation of innovative metasurfaces at 5GHz as well as compact highly integrated 5G antenna-in-modules at 40 GHz. There is a fa
Autor:
Dionysios Manessis, G. Varnava, Kypros M. Kossifos, Christos Liaskos, Maria Kafesaki, Alexandros Pitilakis, A. Ostmann, L. Fu, Odysseas Tsilipakos, Manuel Seckel, Anna C. Tasolamprou, K-D. Lang, Sergei A. Tretyakov, Costas M. Soukoulis, Julius Georgiou, Rolf Aschenbrenner, Martin Schneider-Ramelow
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
openaire: EC/H2020/736876/EU//VISORSURF The proposed work is performed in the framework of the FET-EU project "VISORSURF", which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e6782d654ab95fdd82a0d322f1861be
https://aaltodoc.aalto.fi/handle/123456789/101649
https://aaltodoc.aalto.fi/handle/123456789/101649
Autor:
Lutz Stobbe, K.-F. Becker, Martin Schneider-Ramelow, K-D. Lang, Lars Boettcher, Ole Hoelck, M. Voitel, Tanja Braun, Steve Voges, Michael Topper, Rolf Aschenbrenner
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
Drivers for 3D packaging solutions are manifold and each requirement calls for different answers and technologies. Main goal is miniaturization, but component density and performance, simplification of design and assembly, flexibility, functionality
Autor:
Tanja Braun, Steve Voges, K.-F. Becker, Martin Schneider-Ramelow, R. Kahle, K-D. Lang, O. Holck, Marc Dreissigacker, J. Bauer, Rolf Aschenbrenner
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Within the European funded project smart-MEMPHIS the goal was to tackle the main challenge for all smart devices – self-powering. The project was aimed to design, manufacture and test a miniaturized autonomous energy supply based on harvesting vibr
Autor:
Martin Schneider-Ramelow, V. Bader, Gerd Jungmann, S. Voges, Jeremias Pauls, Karl-Friedrich Becker, Tanja Braun, Mathias Minkus, Hubert Wieser, K-D. Lang
Publikováno v:
International Symposium on Microelectronics. 2017:000182-000187
The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprin
Autor:
Karl-Friedrich Becker, R. Kahle, S. Raatz, James M. Bauer, S. Voges, Mathias Minkus, Tanja Braun, Leopold Georgi, V. Bader, K-D. Lang, Markus Wohrmann, R. Aschenbrenner
Publikováno v:
International Symposium on Microelectronics. 2016:S1-S23
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are
Autor:
Tanja Braun, K-D. Lang, R. Kahle, S. Voges, K.-F. Becker, Martin Schneider-Ramelow, T. Thomas, M. Koch, S. Raatz, M. Fliess, J. Bauer
Publikováno v:
International Symposium on Microelectronics. 2016:000345-000350
Today's microelectronics packaging especially for SiPs relies on the processing of a wide variety of materials Such as materials for components, substrates, contact materials (solder & adhesives) and encapsulants. Most materials are processed as bulk
Publikováno v:
Energy Harvesting and Systems. 3:277-285
This work focuses on a polymer based capacitive harvester which can be fabricated with help of roll-to-roll and low cost printing methods. In contrast to electrostatic MEMS based parallel plate transducers or dielectric elastomer systems here, the ca