Zobrazeno 1 - 10
of 253
pro vyhledávání: '"K Appelt"'
Publikováno v:
CVIR Endovascular, Vol 4, Iss 1, Pp 1-7 (2021)
Abstract Purpose The current literature on the use of brachial artery access is controversial. Some studies found increased puncture site complications. Others found no higher complication rates than in patients with femoral or radial access. The pur
Externí odkaz:
https://doaj.org/article/8cc53775cfa84fdf83f422d47b454436
Publikováno v:
CVIR Endovascular, Vol 4, Iss 1, Pp 1-7 (2021)
CVIR Endovascular
CVIR Endovascular
PurposeThe current literature on the use of brachial artery access is controversial. Some studies found increased puncture site complications. Others found no higher complication rates than in patients with femoral or radial access. The purpose of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5a68eda32f430b65a7d0d97a53f1ea4b
https://www.zora.uzh.ch/id/eprint/208643/
https://www.zora.uzh.ch/id/eprint/208643/
Publikováno v:
European Heart Journal - Cardiovascular Imaging. 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e26634473d55917693e85b8d371f84d
https://doi.org/10.1093/ehjci/jez110.025
https://doi.org/10.1093/ehjci/jez110.025
Autor:
Matthias Schiemann, Uwe K. Appelt, Tim Sparwasser, Ulrike Billmeier, Roland Lang, Stefan Wirtz, Stephen M. Keyse, Jurjen Tel, Sandra Muench, Faizal A. M. Raffi, Joerg Mages, Katrin Jozefowski, Carl G. Figdor, Hubertus Hochrein, Nour Alati, Katharina Lahl, Magdalena Niedzielska
Publikováno v:
Journal of Immunology, 195, 4, pp. 1753-62
Journal of Immunology, 195, 1753-62
Journal of Immunology, 195, 1753-62
Plasmacytoid dendritic cells (pDCs) efficiently produce large amounts of type I IFN in response to TLR7 and TLR9 ligands, whereas conventional DCs (cDCs) predominantly secrete high levels of the cytokines IL-10 and IL-12. The molecular basis underlyi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c57ed22bb234423ce4395fab09aac3bf
https://doi.org/10.4049/jimmunol.1400658
https://doi.org/10.4049/jimmunol.1400658
Autor:
Bernd K. Appelt
Publikováno v:
Materials for Advanced Packaging ISBN: 9783319450971
Materials for Advanced Packaging ISBN: 9780387782188
Materials for Advanced Packaging ISBN: 9780387782188
This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), build-up substrates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some spe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef413e92c49b81aa747fe4070bd68ad3
https://doi.org/10.1007/978-3-319-45098-8_7
https://doi.org/10.1007/978-3-319-45098-8_7
Publikováno v:
International Symposium on Microelectronics. 2012:001149-001154
The continued drive for miniaturization by mobile applications demands its toll also from packaging. Innovative packages are required to shrink volume and weight of packages. This has led to the development of single layer, coreless and embedded comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a6380d216e6f217e1c476d9d11fcd9c
https://doi.org/10.4071/isom-2012-thp45
https://doi.org/10.4071/isom-2012-thp45
Autor:
Bernd K. Appelt
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001477-001506
What does thin or ultra-slim packaging mean? That of course depends on the particular cross-section of the substrate e.g. single layer vs. double layer vs. coreless or embedded component substrate, etc. The thinnest prepreg based substrate and concom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4ef15678428e41e52639a9ea520139d
https://doi.org/10.4071/2012dpc-wa21
https://doi.org/10.4071/2012dpc-wa21
Publikováno v:
International Symposium on Microelectronics. 2012:001143-001148
Historically, power die like MOSFETs have been packaged on lead frames using wire bonds as interconnects. To facilitate current carrying requirements, thick wires and sometimes also clips were used, to handle the total electrical and thermal conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::283252a2c99e34cee2e12983bb0b8ff6
https://doi.org/10.4071/isom-2012-thp44
https://doi.org/10.4071/isom-2012-thp44
Publikováno v:
Der Urologe. 50:714-718
Nierenverletzungen gehoren zu den seltener auftretenden urologischen Erkrankungen. In den vergangenen Jahren wurden Leitlinien zur Behandlung von urologischen Verletzungen durch die „Societe d‘Urologie“ (SIU) und die „European Association of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43a6bb81f061c7187c381d9ab721c786
https://doi.org/10.1007/s00120-011-2554-2
https://doi.org/10.1007/s00120-011-2554-2
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002377-002403
fcCSP packaging was historically based on solder interconnects. The continued drive towards higher I/O and shrinking package sizes has lead to very dense bump pitches which exceed those of CPUs. At area array bump pitches below 150 um, solder bumps r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::783487d3e1c84c766aba59aece4c01e7
https://doi.org/10.4071/2011dpc-tha32
https://doi.org/10.4071/2011dpc-tha32