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Autor:
Küçük, Seniz Esra
Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::00ef1c4dda4af7b4cefd037a0a00ce7a
https://infoscience.epfl.ch/record/232580
https://infoscience.epfl.ch/record/232580
In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connecti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::061ccbaae4789b4fd4473d5fe94b4b79
https://infoscience.epfl.ch/record/202066
https://infoscience.epfl.ch/record/202066
Autor:
Kucuk, Seniz Esra
This thesis presents the design, fabrication and characterization of high performance and high fill factor surface micromachined uncooled infrared resistive microbolometer detectors which can be used in large format focal plane arrays (FPAs). The det
Externí odkaz:
http://etd.lib.metu.edu.tr/upload/12613738/index.pdf
Autor:
Calamandrei, Hugo
Nowadays almost all the mobile networks use the 4G and will eventually soon use the 5G. To use this technology, devices need lots of band filters. This is why the Advanced NEMS laboratory of the EPFL is developing a new kind of MEMS resonant device a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::a1ebf278ca4aea7121bcf8f6787e94e1
https://infoscience.epfl.ch/record/293687
https://infoscience.epfl.ch/record/293687