Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jyun-Yan Chuang"'
Publikováno v:
International Journal of Automation and Smart Technology, Vol 3, Iss 2, Pp 107-115 (2013)
Extreme ultraviolet lithography (EUVL) is widely seen as a key technology for future semiconductor mass production. However, due to the short wavelength material properties of EUV, it is strongly absorbed by most materials. Thus if the shutter for a
Externí odkaz:
https://doaj.org/article/8be6d52492724c4b9a5f0dfbf7d2cc81
Autor:
I-Ching Sheng, Yu-Tsun Cheng, Chin Shueh, Ling-Hui Wu, Jyun Yan Chuang, Chin-Chun Chang, Chien-Kuang Kuan, Che-Kai Chan
Publikováno v:
Vacuum. 151:25-29
The Taiwan Photon Source Front End (TPS FE) vacuum systems are located between the storage ring and beam lines and include various high-heat-load (HHL) components. We investigate the change in dynamic pressure over time in the FE vacuum system, inclu
Publikováno v:
SII
When performing a modal analysis of a structural system with close modes or high damping, the results of identification may be poor due to modal interference, which refers to the phenomenon that vibration energy of each mode of a system may overlap w
Publikováno v:
International Journal of Automation and Smart Technology, Vol 3, Iss 2, Pp 107-115 (2013)
Extreme ultraviolet lithography (EUVL) is widely seen as a key technology for future semiconductor mass production. However, due to the short wavelength material properties of EUV, it is strongly absorbed by most materials. Thus if the shutter for a
Publikováno v:
SMC
Microwave Plasma Chemical Vapor Deposition (MPCVD) method can be used to grow various kinds of diamond films and carbon nanotubes at various temperatures. Manufacturing parameters, such as gas flow rate, input microwave power, working distance, depos
Publikováno v:
SMC
In order to improve the reproducibility of mutiwalled carbon nano-tubes (MWCNTs) process, this study integrates the remote monitoring and fuzzy logic control into microwave plasma chemical vapor deposition (MPCVD) system with the reflected microwave
Publikováno v:
2010 IEEE International Conference on Systems Man & Cybernetics (SMC); 2010, p2414-2418, 5p