Review article: recommended reading list of early publications on atomic layer deposition - outcome of the 'virtual Project on the History of ALD'

Autor: Riikka L. Puurunen, Mikhail Chubarov, Tommi Kääriäinen, Cheol Seong Hwang, Çaǧla Özgit-Akgün, Geert Rampelberg, Erwan Rauwel, Rong Chen, Anjana Devi, David Campbell Cameron, Thomas E. Seidel, Jussi Lyytinen, Liliya Elnikova, A. A. Malkov, Markku Leskelä, Georgi Popov, Henrik Pedersen, Tanja Kallio, A. Outi I. Krause, Jaana Kanervo, Jakob Kuhs, Tobias Törndahl, Gloria Gottardi, A. A. Malygin, Nathanaelle Schneider, Fred Roozeboom, Małgorzata Norek, Marja-Leena Kääriäinen, Adam A. Łapicki, Dohan Kim, Irina Kärkkänen, Fabien Piallat, Harri Lipsanen, Esko Ahvenniemi, Oili Ylivaara, Lev Klibanov, Jyrki Molarius, Claudia Wiemer, Shih Hui Jen, J. Ruud van Ommen, Andrew R. Akbashev, Kestutis Grigoras, Dmitry Suyatin, Christian Militzer, Yury Koshtyal, Hele Savin, Jonas Sundqvist, Timo Sajavaara, Luca Lamagna, Véronique Cremers, Stefan Ivanov Boyadjiev, Mikhail Panov, Saima Ali, Oksana Yurkevich, Dennis M. Hausmann, Ivan Khmelnitskiy, Hossein Salami, Viktor Drozd, Mikhael Bechelany, Robin H. A. Ras, Abdelkader Mennad, Maria Berdova

Publikováno v: Journal of Vacuum Science and Technology. Part A: International Journal Devoted to Vacuum, Surfaces, and Films, 35(1)
Journal of Vacuum Science and Technology A
Journal of Vacuum Science and Technology A, American Vacuum Society, 2017, 35 (1), ⟨10.1116/1.4971389⟩
Journal of Vacuum Science and Technology A: Vacuum, Surfaces, and Films, 35(1):010801, 1-13. AVS Science and Technology Society
Ahvenniemi, E, Akbashev, A, Ali, S, Bechelany, M, Berdova, M, Boyadjiev, S, Cameron, D, Chen, R, Chubarov, M, Cremers, V, Devi, A, Drozd, V, Elnikova, L, Gottardi, G, Grigoras, K, Hausmann, D, Hwang, C S, Jen, S-H, Kallio, T, Kanervo, J, Khmelnitskiy, I, Kim, D H, Klibanov, L, Koshtyal, Y, Krause, O, Kuhs, J, Kärkkänen, I, Kääriäinen, M-L, Kääriäinen, T, Lamagna, L, Lapicki, A, Leskelä, M, Lipsanen, H, Lyytinen, J, Malkov, A, Malygin, A, Mennad, A, Militzer, C, Molarius, J, Norek, M, Özgit-Akgün, Ç, Panov, M, Pedersen, H, Piallat, F, Popov, G, Puurunen, R, Rampelberg, G, Ras, R H A, Rauwel, E, Roozeboom, F, Sajavaara, T, Salami, H, Savin, H, Schneider, N, Seidel, T E, Sundqvist, J, Suyatin, D, Törndahl, T, van Ommen, J R, Wiemer, C, Ylivaara, O & Yurkevich, O 2017, ' Review Article: Recommended reading list of early publications on atomic layer deposition : Outcome of the "Virtual Project on the History of ALD" ', Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, vol. 35, no. 1, 010801 . https://doi.org/10.1116/1.4971389
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2, 35
Journal of Vacuum Science & Technology A
Journal of Vacuum Science & Technology A, 2017, 35 (1), ⟨10.1116/1.4971389⟩

Atomic layer deposition (ALD), a gas-phase thin film deposition technique based on repeated, self-terminating gas-solid reactions, has become the method of choice in semiconductor manufacturing and many other technological areas for depositing thin c

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fa895b65e04c902eab774083e92e5f89
https://doi.org/10.1116/1.4971389

Electrode metallization for high permittivity oxide RF thin film capacitors

Autor: Tommi Riekkinen, Jyrki Molarius, Markku Ylilammi

Publikováno v: Riekkinen, T, Molarius, J & Ylilammi, M 2007, ' Electrode metallization for high permittivity oxide RF thin film capacitors ', Journal of the European Ceramic Society, vol. 27, no. 8-9, pp. 2983-2987 . https://doi.org/10.1016/j.jeurceramsoc.2006.11.060

High permittivity oxide thin film capacitors for RF components should be integrated on the chip to form a complete miniaturized module, with other semiconductor or thin film components such as inductors, isolation capacitors, and bias resistors. The

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b9dd25ad9b9aa9d11ee8f72864e6abe
https://doi.org/10.1016/j.jeurceramsoc.2006.11.060

Thin Film Piezomaterials for Bulk Acoustic Wave Technology

Autor: Martin Kulawski, Tommi Riekkinen, Markku Ylilammi, Jyrki Molarius

Publikováno v: The Nano-Micro Interface : Bridging the Micro and Nano Worlds
Molarius, J, Riekkinen, T, Kulawski, M & Ylilammi, M 2015, Thin Film Piezomaterials for Bulk Acoustic Wave Technology . in M Van de Voorde, M Werner & H-J Fecht (eds), The Nano-Micro Interface : Bridging the Micro and Nano Worlds . 2nd edn, Wiley, pp. 243-270 . https://doi.org/10.1002/9783527679195.ch13

In the first edition of "The Nano-Micro Interface," we discussed the piezoelectric quality of zinc oxide (ZnO) thin films. In this second edition's chapter, we have extended our view and included other piezoelectric materials like AlN, Sc-alloyed AlN

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::560a61f5ec94bc68a5d7075ece21275a
https://cris.vtt.fi/en/publications/563b1f48-4295-4126-a90a-37bc68e71c13

Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems

Autor: Kejun Zeng, Tommi Riekkinen, Tomi Laurila, Jorma K. Kivilahti, Jyrki Molarius, Ilkka Suni

Publikováno v: Laurila, T, Zeng, K, Molarius, J, Riekkinen, T, Suni, I & Kivilahti, J K 2002, ' Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems ', Microelectronic Engineering, vol. 64, no. 1-4, pp. 279-287 . https://doi.org/10.1016/S0167-9317(02)00800-6

The effect of oxygen on the reactions in the Si/Ta/Cu and Si/TaC/Cu metallization systems was investigated by utilizing the assessed Ta–O binary and the evaluated ternary Ta–C–O phase diagrams together with detailed transmission electron micros

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b55fdee16aec824f5ae5b06f2db39b3c
https://doi.org/10.1016/S0167-9317(02)00800-6

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Autor: Jaakko Salonen, Heikki Viljanen, Tommi Suni, Pradeep Dixit, Jyrki Molarius, Philippe Monnoyer

Publikováno v: Dixit, P, Viljanen, H, Salonen, J, Molarius, J & Monnoyer, P 2013, Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias . in 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2013 . IEEE Institute of Electrical and Electronic Engineers, pp. 190-193, 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference-Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013, Taipei, Taiwan, Province of China, 22/10/13 . https://doi.org/10.1109/IMPACT.2013.6706634

The fabrication, electrical characterization and reliability study of copper through-silicon via (TSV) is reported. All the fabrication steps needed in this process have a process temperature

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::597dce3b70ffb6de97004f731ddd05eb
https://cris.vtt.fi/en/publications/cd8728a1-1d2f-47ac-8108-68690090bfec