Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Jyh-Rong Lin"'
Publikováno v:
Microelectronics Reliability. 52:916-921
In this paper, we have developed and revealed the wafer-level LED system-in-packaging (WL-LED-SiP) design and process platform. This platform provided an LED system solution with high packaging density, high performance, high reliability and cost eff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d985b3730fb9fd39cec8ec9a231d70a7
https://doi.org/10.1016/j.microrel.2011.07.092
https://doi.org/10.1016/j.microrel.2011.07.092
Autor:
Jyh-Rong Lin, Raymond S. T. Lee
Publikováno v:
IEEE Transactions on Systems, Man and Cybernetics, Part B (Cybernetics). 31:413-417
In this paper, an elastic graph dynamic link model (EGDLM) based on elastic contour matching is proposed to automate the Dvorak technique for tropical cyclone (TC) pattern interpretation from satellite images. This method integrates traditional dynam
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::159cb6b70da59471dadfe08e4deb388f
https://doi.org/10.1109/3477.931532
https://doi.org/10.1109/3477.931532
Publikováno v:
2009 Asia Pacific Microwave Conference.
We present a thin film on modified ceramic (TFoMC) technique in this work to achieve high-accuracy and high-uniformity design. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, are realized based on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26047c910381f9864bf9d94a215b0fba
https://doi.org/10.1109/apmc.2009.5384456
https://doi.org/10.1109/apmc.2009.5384456
Publikováno v:
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
We have developed a thin-film on modified ceramic (TFoMC) technology in this work to achieve high-density, high-accuracy and high-uniformity substrate technology for RF-related applications. Integrated passive devices (IPDs), including capacitors, in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::692482ac0416985a25880905c2eb07fa
https://doi.org/10.1109/edaps.2009.5403984
https://doi.org/10.1109/edaps.2009.5403984
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
In this paper, we have developed a Thin Film on Modified Ceramic (TFoMC) technology which provides not only a low-cost but also high-performance solution, especially for wireless local-area network (WLAN) related applications. To begin with, a warpag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::649b1fd4fb6c0faf7cd263a6777430fb
https://doi.org/10.1109/impact.2009.5382120
https://doi.org/10.1109/impact.2009.5382120
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
For several kinds of advanced applications, such as RFID, telecommunication, portable electronics, or wearable electronics, the need of packaged semiconductor chip thick is getting thinner drastically. One representative technology is to embed an act
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f8b96da4426c4d806c1e513802959ab
https://doi.org/10.1109/ectc.2005.1441990
https://doi.org/10.1109/ectc.2005.1441990
Autor:
Tzu-Ying Kuo, Yu-Hua Chen, Jyh-Rong Lin, A. Neumann, Shou-Lung Chen, A. Ostmann, Cheng-Ta Ko, Chien-Wei Chien, Shan-Pu Yu
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
The structure of chip-in-substrate package, CiSP, is shown. The thin chips (50mum) are bonded on the organic substrate (BT) flatly. Subsequently, the chips are covered among the build-up dielectric layer, which can be either a RCC (resin coated coppe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee328116d8ec9904a644d7a4a2cf708
https://doi.org/10.1109/eptc.2004.1396677
https://doi.org/10.1109/eptc.2004.1396677
Autor:
Jyh-Rong Lin, Yu-Jiau Hwang, Hsu-Tien Hu, Yu-Chih Chen, Ruoh-Huey Uang, Kuo-Chuan Chen, Shu-Ming Chang
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Recently, flip chip package has obtained more and more attentions due to its benefits of high I/O, low inductance and better thermal dissipation. Therefore flip chip package is getting to be used in some high performance and high speed devices such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e3bd4aa358d807930abc4ee03a6ad7c
https://doi.org/10.1109/eptc.2002.1185680
https://doi.org/10.1109/eptc.2002.1185680
Autor:
Kuo-Chuan Chen, Jyh-Rong Lin, Shu-Ming Chang, Wei-Chung Lo, Yu-Chih Chen, Hsu-Tien Hu, Yu-Jiau Hwang, Li-Cheng Shen
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
In this paper, one of the wafer level chip scale packaging (WL-CSP) patents issued by ERSO/ITRI, the double elastomer wafer level package, is implemented on the test vehicle of Rambus DRAM to demonstrate the applicability and reliability of WL-CSP fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::898700eac18f584f6622a51fe281ea19
https://doi.org/10.1109/eptc.2002.1185671
https://doi.org/10.1109/eptc.2002.1185671
Publikováno v:
2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1568-1574, 7p