Zobrazeno 1 - 10
of 282
pro vyhledávání: '"Jutman, A."'
Data produced by on-chip sensors in modern SoCs contains a large amount of information such as occurring faults, aging status, accumulated radiation dose, performance characteristics, environmental and other operational parameters. Such information p
Externí odkaz:
http://arxiv.org/abs/2308.15917
With the current increase in the data produced by the Large Hadron Collider (LHC) at CERN, it becomes important to process this data in a corresponding manner. To begin with, to efficiently select events that contain relevant information from a massi
Externí odkaz:
http://arxiv.org/abs/2212.04374
Publikováno v:
In Microelectronics Reliability July 2023 146
Publikováno v:
Microelectronics Reliability. 146:115010
Autor:
Jutman, Magnus, Lejervik, Carl
Bakgrund: Patellar tendinopati (PT) är framförallt en vanlig diagnos bland aktiva inom idrotter där hopprörelser ofta förekommer. Diagnosen innebär ofta överbelastning av knäskålsenan, vilket leder till smärta och nedsatt funktionsförmåga
Externí odkaz:
http://urn.kb.se/resolve?urn=urn:nbn:se:mdh:diva-47602
Autor:
Elena Ioana Vatajelu, Jaan Raik, Matteo Sonza Reorda, Mehdi B. Tahoori, Maria K. Michael, Artur Jutman, Stephan Eggersgluss, Said Hamdioui
Publikováno v:
IEEE International Test Conference (ITC'2019)
IEEE International Test Conference (ITC'2019), Nov 2019, Washington DC, United States. IEEE
ITC
IEEE International Test Conference (ITC'2019), Nov 2019, Washington DC, United States. pp.1-4, ⟨10.1109/ITC44170.2019.9000148⟩
IEEE International Test Conference (ITC'2019), Nov 2019, Washington DC, United States. IEEE
ITC
IEEE International Test Conference (ITC'2019), Nov 2019, Washington DC, United States. pp.1-4, ⟨10.1109/ITC44170.2019.9000148⟩
International audience; This paper is dedicated to the IEEE European Test Symposium (ETS). It offers an overview of all the European Test Workshop and Symposium events, from its first edition in 1996 to the next edition in 2020.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::251e7241dae7d24e66b5989df932784e
https://hal.archives-ouvertes.fr/hal-02506911
https://hal.archives-ouvertes.fr/hal-02506911
Publikováno v:
Proc. IEEE European Test Symposium 2019 (in press)
ETS
ETS
The increasing number of embedded instruments used to perform test, monitoring, calibration and debug within a semiconductor device has called for a brand new standard—the IEEE 1687. Such a standard resorts to a reconfigurable scan network to provi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92ce52f0aafe07466b4e84b6346cc9b3
Autor:
Sergei Odintsov, Thomas Wenzel, Artur Jutman, Igor Aleksejev, Sergei Devadze, Heiko Ehrenberg
Publikováno v:
2019 IEEE AUTOTESTCON.
With continually growing adoption of FPGA based designs, and more features and capabilities available in FPGAs, board and system level test applications can - and should - take advantage of FPGA embedded instrumentation. Such FPGA assisted tests not
Publikováno v:
2019 IEEE European Test Symposium (ETS).
Publikováno v:
DDECS
Nowadays, increasing demand for High-Performance Systems produces significant growth in usage of Field Programmable Gate Arrays (FPGAs) for different applications thanks to their flexibility and high level of parallelism. Such systems rely on complex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08bdd1ca31ecc56850ad96a422d511e1
http://hdl.handle.net/11583/2735942
http://hdl.handle.net/11583/2735942