Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Juthika Basak"'
Autor:
Mehrdad Mirshafiei, Francesco Vacondio, Leslie A. Rusch, Ling Liao, Juthika Basak, Ansheng Liu, Mario J. Paniccia
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 16:141-148
We investigate the linearity properties of silicon modulators and show that, contrary to the traditional lithium niobate Mach-Zehnder modulators (MZMs), the third-order intermodulation distortion (IMD3) for silicon modulators is a function of the mod
Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 16:23-32
We review recent advances in the development of silicon photonic integrated circuits for high-speed and high-capacity interconnect applications. We present detailed design, fabrication, and characterization of a silicon integrated chip based on wavel
Autor:
Doron Rubin, Nahum Izhaky, Yoel Chetrit, Juthika Basak, Rami Cohen, Mario J. Paniccia, Dean A. Samara-Rubio, Ling Liao, Ansheng Liu, Hat Nguyen
Publikováno v:
Advances in Optical Technologies. 2008:1-10
This paper describes the recent advances made in silicon optical modulators employing the free carrier dispersion effect, specifically those governed by majority carrier dynamics. The design, fabrication, and measurements for two different devices ar
Autor:
Stevan S. Djordjevic, Kuanping Shang, Stanley T. S. Cheung, Juthika Basak, Binbin Guan, Chuan Qin, S. J. B. Yoo, Hai-Feng Liu, Ling Liao
Publikováno v:
2013 Optical Interconnects Conference.
We present design, fabrication and measurement of athermal silicon ring modulators fabricated on a SOI platform, overclad with 830nm thick amorphous titanium dioxide. Current injection achieves 35 dB extinction intensity modulation.
Autor:
Stevan S. Djordjevic, Jun Li, Hai-Feng Liu, Juthika Basak, Ling Liao, S. J. B. Yoo, Kuanping Shang
Publikováno v:
CLEO: 2013.
We discuss titanium dioxide material development for CMOS compatible fabrication and integration of athermal silicon photonic components. Titanium dioxide overclad ring modulators achieved athermal operation (< 0.2 GHz/°C).
Autor:
John Heck, Brian R. Koch, Haisheng Rong, Robert Beatty, Tao Yin, Neal Na, Lior Horwitz, Roi Bar, Ansheng Liu, Mike Morse, Andrew Alduino, Dror Lazar, Ling Liao, Kevin Sullivan, Brian H. Kim, Hai-Feng Liu, Christine Krause, Richard Jones, Frederic Haubensack, Rushdy Saba, Mathew N. Sysak, Olufemi I. Dosunmu, Wei-Zen Lo, Juthika Basak, I-Wei Hsieh, Jock Bovington, Mario J. Paniccia, Stas Litski
Publikováno v:
CLEO:2011 - Laser Applications to Photonic Applications.
We demonstrate a 4λx12.5Gbps Silicon Photonics CWDM link integrating all optical components, electronics, and packaging technologies required to form the link.
Autor:
Doron Rubin, Ling Liao, Yoel Chetrit, Juthika Basak, Hat Nguyen, Ansheng Liu, Mario J. Paniccia
Publikováno v:
Topics in Applied Physics ISBN: 9783642105050
As microprocessor technology advances toward multi-core and many-core architectures, optical interconnect is considered a promising way of meeting the associated demand for giga-scale and tera-scale input/output (I/O). While traditional optical commu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af706acaf85c2a49aeb4f7c8ae6851f2
https://doi.org/10.1007/978-3-642-10506-7_7
https://doi.org/10.1007/978-3-642-10506-7_7
Autor:
Brian H. Kim, Neil Na, Hyundai Park, Dror Lazar, Matthew N. Sysak, John Heck, Richard Jones, Mahtab Hakami, Frederick Haubensack, Priya Merani, Ling Liao, Christine Krause, Katie Nguyen, Brian R. Koch, Ansheng Liu, Robert Beatty, Hinmeng Au, Tao Yin, Wei-Zen Lo, Juthika Basak, Mario J. Paniccia, Lior Horwitz, Simon S. Lee, Hai-Feng Liu, Olufemi I. Dosunmu, Andrew Alduino, Jock Bovington, Haisheng Rong, I-Wei Hsieh, Hat Nguyen, Kevin Sullivan, Rushdy Saba, Roi Bar, Mike Morse, Stas Litski
Publikováno v:
Integrated Photonics Research, Silicon and Nanophotonics and Photonics in Switching.
The demonstration of a 4λ×10Gbps Silicon Photonics CWDM link integrating all optical components, electronics and packaging technologies required for system integration is reported. Further demonstration of the link operating at 50Gbps, 4λ×12.5Gbp
Publikováno v:
2008 IEEE International Electron Devices Meeting.
We present recent results of a silicon photonic integrated chip that is capable of transmitting data at an aggregate rate of 200 Gb/s. It is based on wavelength division multiplexing where an array of eight high speed silicon optical modulators are m
Publikováno v:
2008 International Topical Meeting on Microwave Photonics jointly held with the 2008 Asia-Pacific Microwave Photonics Conference.
In this paper, we review recent results of high-speed silicon photonic modulators based on electrical-field-induced carrier depletion effect in a silicon-on-insulator waveguide. We also present detailed design, fabrication, and characterization of a