Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Juritza, A."'
Autor:
Karacan, Ipek, Ben-Nissan, Besim, Wang, Hang Andy, Juritza, Arion, Swain, Michael V., Müller, Wolfgang H., Chou, Joshua, Stamboulis, Artemis, Macha, Innocent J., Taraschi, Valerio
Publikováno v:
In Materials Science & Engineering C November 2019 104
Autor:
Arion Juritza, Michael V. Swain, Artemis Stamboulis, Innocent J. Macha, Besim Ben-Nissan, Ipek Karacan, Valerio Taraschi, Hang Andy Wang, Joshua Chou, Wolfgang H. Müller
Publikováno v:
Materials scienceengineering. C, Materials for biological applications. 104
© 2019 Elsevier B.V. Post-operative infection often occurs following orthopedic and dental implant placement requiring systemically administered antibiotics. However, this does not provide long-term protection. Over the last few decades, alternative
Publikováno v:
Advanced Structured Materials ISBN: 9783030133061
Additive manufacturing methods, commonly known as 3D printing, enable the design and manufacturing of complex and sophisticated material fabrics with a special substructure resulting in extraordinary macroscopic deformation behavior. Such a man-made
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7b992a5da8cb2d870602f3c1580ad1e
https://doi.org/10.1007/978-3-030-13307-8_15
https://doi.org/10.1007/978-3-030-13307-8_15
Autor:
David Grossin, Faik N. Oktar, Michael V. Swain, Andy H. Wang, Besim Ben-Nissan, Wolfgang H. Müller, Ipek Karacan, Valerio Taraschi, Arion Juritza, Joshua Chou, Innocent J. Macha
Surface modifications have been progressively applied in order to improve the mechanical, biological and chemical properties of metallic dental and orthopedic implants. Therefore, the novel and multifunctional biocomposites coating matrices, which al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c845e32b5aff04646dc6dfae5b5ab6e9
https://hdl.handle.net/10453/160700
https://hdl.handle.net/10453/160700
Publikováno v:
Microsystem Technologies. 15:45-55
Fabrication of modern microelectronic components requires miscellaneous solder materials for joining. In order to guarantee the quality of the manufacturing process and the reliability of the resulting solder joint it is necessary to know the materia
Publikováno v:
Archive of Applied Mechanics. 74:728-738
In what follows we determine the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Additionally, we try to answer the question of whether nanoindentation can be used to quantify the growth o
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of interme
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
In order to guarantee reliability of semiconductor devices for automotive applications an optimized package design is required. Clearly the design must be based on the best choice of geometry, materials and manufacturing processes. It is well known t
Publikováno v:
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
The reliability of semiconductor devices in automotive environmental conditions requires optimized package design with respect to geometry, materials and manufacturing processes. Process steps at high temperatures can result in high package stresses
Autor:
A. Vogliano, A. Juritza, J. Villain, H.-J. Albrecht, K. Muller, Jens Sterthaus, Wolfgang H. Müller
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
In this paper we present our results on how nanoindentation can serve for measurement of (local) mechanical properties in microelectronic materials and components. Special attention is paid to the properties of interface regions, i.e., the region of