Zobrazeno 1 - 10
of 43
pro vyhledávání: '"Jurij R. Paraszczak"'
Autor:
Angelo Failla, Rebecca Curzon, Peter Kusterer, Sunil Raghavan, Piera Curotto, Jurij R. Paraszczak, Michael Evason, Ai Ogawa
Publikováno v:
IBM Journal of Research and Development. 64:2:1-2:14
The role of corporations and their corporate social responsibility (CSR)-related response to disasters in support of their communities has not been extensively documented; thus, this article attempts to explain the role that one corporation, IBM, has
Publikováno v:
Computer. 44:32-39
The transformation to smarter cities will require innovation in planning, management, and operations. Several ongoing projects around the world illustrate the opportunities and challenges of this transformation. Cities must get smarter to address an
Autor:
Jose R. Brunheroto, Richard Chernock, David Israel Seidman, Frank A. Schaffa, Jurij R. Paraszczak, X. Dong, Paolo Dettori
Publikováno v:
European Transactions on Telecommunications. 12:231-237
Until the present, the digital television (DTV) industry has focused providing high—quality basic video and audio services. With advancements in the underlying technologies, digital television is likely to evolve into a much more interactive medium
Publikováno v:
IBM Journal of Research and Development. 39:371-381
Advances in interconnection technology have played a key role in allowing continued improvements in integrated circuit density, performance, and cost. ibm contributions to interconnection technology over approximately the last ten generations of semi
Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures
Autor:
W. Graham, Eileen A. Galligan, Sharon L. Nunes, C.-A. Chang, D.-Y. Shih, Janusz S. Wilczynski, John J. Ritsko, J. Lewis, Chandrasekhar Narayan, Laura Beth Rothman, J. Cataldo, Richard P Mcgouey, Helen Li Yeh, Alina Deutsch, Jurij R. Paraszczak, Eric D. Perfecto, Russell J. Serino
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:74-88
The use of a lift-off technique to fabricate a high-density structure consisting of multiple layers of metal/polyimide thin-film structures on a silicon substrate is described. To achieve better performance and high yield, the process design, the pro
Autor:
Jurij R. Paraszczak
Publikováno v:
Notes on Numerical Fluid Mechanics and Multidisciplinary Design ISBN: 9783319981765
CAiSE
CAiSE
Information technology is so pervasive that estimates of its power usage show that data centers, locations where computing systems are densely packed consume some 2% of available power in mature economies. Other estimates show that an additional 8% o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0255016e55b464c2c58e34a8db74220f
https://doi.org/10.1007/978-3-642-13094-6_2
https://doi.org/10.1007/978-3-642-13094-6_2
Autor:
Eileen A. Galligan, D. Y. Shih, Russell J. Serino, Jurij R. Paraszczak, John Cataldo, Sharon L. Nunes
Publikováno v:
Journal of Applied Polymer Science. 46:1291-1299
The diffusion of an organic solvent, N-methylpyrollidinone (NMP), in a fully imidized photosensitive polyimide, 4,4′-benzophenone tetracarboxylic dianhydride (BTDA–tMDA), was investigated. The polyimide (PI) films were prepared by spin-coating, s
Autor:
John E. Heidenreich, G. Coleman, R. D. Goldblatt, A. D. Marwick, Ned J. Chou, Leping Li, Jurij R. Paraszczak
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 10:248-253
Water vapor plasma treatment of polymer surfaces has recently gained renewed interest for its potential applications in biomedical science and microelectronics. We have used an isotope technique to characterize the modified polyimide (PI) films by ex
Publikováno v:
Journal of Applied Physics. 70:3052-3060
Interdiffusion in the Cu‐based Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films has been investigated for anneal temperatures ranging from 150 to 400 °C in forming gas (N2‐10%H2). The diffusion of Pd, Pt, and Ni into Cu
Autor:
W. Graham, G.V. Kopcsay, Sharon L. Nunes, Jurij R. Paraszczak, Janusz S. Wilczynski, J. Cataldo, Russell J. Serino, Eileen A. Galligan, Vincent Ranieri, D. Y. Shih, John J. Ritsko, Richard P Mcgouey, Alina Deutsch
Publikováno v:
IBM Journal of Research and Development. 34:601-615
This paper addresses some of the problems encountered in propagating high-speed signals on lossy transmission lines encountered in high-performance computers. A technique is described for including frequency-dependent losses, such as skin effect and