Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jurgen Pohlner"'
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Among other virtues like good microwave performance, high density of integration, good thermal conductivity, hermeticity, and robustness, LTCC technology (Low Temperature Co-fired Ceramic) facilitates the integration of passive components like resist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68539bfff7bdb0860e129fa41c29d41d
https://doi.org/10.23919/nordpac.2018.8423847
https://doi.org/10.23919/nordpac.2018.8423847
Autor:
Jens Muller, Tilo Welker, Peter Uhlig, Dieter Schwanke, Thomas Rittweg, Ulrich Altmann, Alexandra Serwa, Jurgen Pohlner
Publikováno v:
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Low Temperature Co-fired Ceramic (LTCC) is a proven packaging technology for microwave and millimetre-wave applications. Advanced low-loss material systems and improved manufacturing technology facilitate economic and highly reliable packaging soluti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4c4801c8604cb429b5918e2499265821
https://doi.org/10.1109/nordpac.2017.7993171
https://doi.org/10.1109/nordpac.2017.7993171
Autor:
Matthias Hein, T. Baras, Dirk Stopel, A. Schwarz, Ralf Stephan, G. Möllenbeck, J.F. Trabert, A.F. Jacob, C. Gunner, P. Uhlig, R. Kulke, Stefan Humbla, A. Molke, Gabor Vogt, Jurgen Pohlner, G. Reppe, K.-H. Drue, Jens Muller, D. Schwanke
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 6:27-31
KERAMIS is the acronym of a German research and development project funded by the German Space Agency (DLR) and the Federal Ministry of Economics and Technology (BMWI). The consortium is developing an RF circuit technology for Ka band multimedia sate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad5e318372c70f7143d7101b3f57f7d7
https://doi.org/10.4071/1551-4897-6.1.27
https://doi.org/10.4071/1551-4897-6.1.27
Autor:
Ralf Stephan, A. Molke, A.F. Jacob, P. Uhlig, D. Schwanke, Jens Muller, T. Baras, Matthias Hein, Jurgen Pohlner, R. Kulke, G. Reppe, Ruben Perrone, K.-H. Drue, J.F. Trabert
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 4:99-104
Low-temperature co-fired ceramic (LTCC) are widely acknowledged for wide-band and microwave circuits. Within the project consortium KERAMIS, implementation of higher functionality in LTCC substrates is being investigated. Among the applications consi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bcc318ca2edf82013d96a542ec5fcc4
https://doi.org/10.4071/1551-4897-4.3.99
https://doi.org/10.4071/1551-4897-4.3.99
In LTCC technology, printing is the most reliable and cost-effective process for line deposition on ceramic layers. An enhancement of resolution is required to realize modules in the highest frequency range which requires small lines and distances. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5018c7fe3691f57c7319ff78be09f022
https://publica.fraunhofer.de/handle/publica/219846
https://publica.fraunhofer.de/handle/publica/219846
Autor:
Heiko Thust, Ruben Perrone, J.F. Trabert, Matthias Hein, A. Molke, R. Kulke, Jens Muller, Jurgen Pohlner, G. Reppe, C. Kutscher, P. Uhlig, K.-H. Drue, Ralf Stephan, D. Schwanke, T. Baras, A.F. Jacob
Publikováno v:
2006 1st Electronic Systemintegration Technology Conference.
Low temperature co-fired ceramics (LTCC) is being widely used for microwave circuits. The BMBF funded R&D-project KERAMIS focuses on larger implementation of functionality in LTCC substrates to allow designs with "standard" MMICs. Target applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eeaafe0fdafcca7a153aa8b2f4eda8ed
https://doi.org/10.1109/estc.2006.279987
https://doi.org/10.1109/estc.2006.279987