Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Jupyo Hong"'
Publikováno v:
IEEE Transactions on Power Electronics. 38:6015-6023
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0a8cb46730647470842cddbb3457d64
https://doi.org/10.1109/tpel.2023.3243303
https://doi.org/10.1109/tpel.2023.3243303
Autor:
Sunhee Moon, Jupyo Hong, Seung-Wook Park, Young-Do Kweon, Do-Jae Yoo, Chang-Bae Lee, Hyung-Jin Jeon, Jin-soo Kim
Publikováno v:
International Symposium on Microelectronics. 2010:000333-000338
Recently the package market is demanding the smaller package size and the lower impedance electrical path with a short interconnection. The wafer level chip scale package is one of them, which has the solution of the market needs above. However, WLCS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4405337db7009c5d51e01c49ba9dd26c
https://doi.org/10.4071/isom-2010-tp5-paper2
https://doi.org/10.4071/isom-2010-tp5-paper2
Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP)
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
In this study a WLCSP structure in microelectronic application is considered. In the current development of WLCSP solder post is used to bridge the die and solder bump to release part of the stress concentration caused by mismatch of Thermal Expansio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::077552a53ae899cdce425b4f49174cf2
https://doi.org/10.1109/estc.2008.4684436
https://doi.org/10.1109/estc.2008.4684436
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
WL-CSP (wafer level - chip scale package) has many advantages such as low cost, easy fabrication and ultimate miniature size, even though solder joint reliability (SJR) of conventional WL-CSP is critical weak point of the technology. Therefore, many
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35ef6a038b06dfcf1545e32ece7aeb76
https://doi.org/10.1109/estc.2008.4684347
https://doi.org/10.1109/estc.2008.4684347
Publikováno v:
2008 58th Electronic Components and Technology Conference.
In this study, high brightness LED package is considered. Steady state heat transfer process analysis is firstly carried out using 3-D finite element method. Temperature distribution and thermal resistance of the package are then determined. The FEM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b991323c396b92ad1aa4ac5453e40695
https://doi.org/10.1109/ectc.2008.4550066
https://doi.org/10.1109/ectc.2008.4550066
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In this study, the warpage of WLAN strip after reflow process, which contains 7times5 WLAN modules, is considered. 3D thermo-mechanical FEM simulation is carried out to find out the warpage distribution and maximum warpage after reflow process. Exper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15abc6d0126cfe344f5dc7a8256054da
https://doi.org/10.1109/emap.2007.4510278
https://doi.org/10.1109/emap.2007.4510278
Publikováno v:
2007 8th International Conference on Electronic Packaging Technology.
System in package (SiP) has the ability to integrate other components, such as passive component and antenna, into a single package to realize complete system functions. However, there are many electrical and mechanical reliability issues including t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89fa093058f1258b23ee6619b398aff5
https://doi.org/10.1109/icept.2007.4441427
https://doi.org/10.1109/icept.2007.4441427
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
In this paper, wafer level packaging of a surface acoustic wave (SAW) filter is considered. Numerical studies based on a three-dimensional finite element method (FEM) have been conducted in order to evaluate the reliability of a wafer level SAW packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f24148cb78df36bcf4ebd0aec4b949a7
https://doi.org/10.1115/ipack2007-33031
https://doi.org/10.1115/ipack2007-33031
Autor:
Jae Chun Do, Jin Gu Kim, Jupyo Hong, Tae Hyun Kim, Sung Yi, Yan Shuang Guo, Shan Guo, Chang Mu Jung, Jae Ky Roh
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
During the manufacturing process of the system-in-package, it has become susceptible to defects and internal residual stresses when dies, components, electric functionality and geometric complexity have increased. The mismatch of thermal expansion co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1d117771d17dcb1f63a935e5b2a84d7
https://doi.org/10.1115/ipack2007-33034
https://doi.org/10.1115/ipack2007-33034
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
High Brightness (HB) Light emitting diode (LED) technology is becoming the choice for many lighting applications. However, one potential problem with LED based lighting systems is the thermal issue during service, which has restricted LED in the appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::189e700c75380199275c2ad7d38c03af
https://doi.org/10.1115/ipack2007-33103
https://doi.org/10.1115/ipack2007-33103