Zobrazeno 1 - 10
of 61
pro vyhledávání: '"Junwen Ren"'
Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites
Autor:
Wenfu Wei, Zhanglin Huang, Guofeng Yin, Zefeng Yang, Xiaobo Li, Haozi Zuo, Qin Deng, Guizao Huang, Junwen Ren, Qianhua Liao, Yan Yang, Guangning Wu
Publikováno v:
High Voltage, Vol 7, Iss 5, Pp 960-967 (2022)
Abstract Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface
Externí odkaz:
https://doaj.org/article/7a5302745be947b1871b7f693d230417
Publikováno v:
Light: Science & Applications, Vol 11, Iss 1, Pp 1-9 (2022)
Abstract Long-lived interlayer excitons (IXs) in van der Waals heterostructures (HSs) stacked by monolayer transition metal dichalcogenides (TMDs) carry valley-polarized information and thus could find promising applications in valleytronic devices.
Externí odkaz:
https://doaj.org/article/4f17ba42075d4a93aaad6f2339d9e65f
Publikováno v:
Nanomaterials, Vol 13, Iss 16, p 2322 (2023)
The demand for high-performance dielectrics has increased due to the rapid development of modern electric power and electronic technology. Composite dielectrics, which can overcome the limitations of traditional single polymers in thermal conductivit
Externí odkaz:
https://doaj.org/article/e57a741816524a7b88bc9990ba0742d4
Autor:
Lihua Zhao, Chengmei Wei, Zihan Li, Wenfu Wei, Lichuan Jia, Xiaolong Huang, Wenjun Ning, Zhong Wang, Junwen Ren
Publikováno v:
Materials & Design, Vol 210, Iss , Pp 110124- (2021)
Aramid paper is ubiquitous in advanced electronics and high-voltage equipment by virtue of their outstanding dielectric properties, mechanical reliability, and thermal stability. However, their limited thermal conductivity still fails to satisfy the
Externí odkaz:
https://doaj.org/article/5c99d60e650c4bab8b41115375ae87c4
Publikováno v:
Nanomaterials, Vol 12, Iss 18, p 3235 (2022)
Epoxy composites with high thermal conductivity, excellent dielectric, and mechanical properties are very promising for solving epoxy cracking faults in reactors and for extending their service life. In this work, we report on epoxy composites enhanc
Externí odkaz:
https://doaj.org/article/a19a40e1bb6d4be0978dd70de3e87c50
Autor:
Junwen Ren, Qihan Li, Lei Yan, Lichuan Jia, Xiaolong Huang, Lihua Zhao, Qichao Ran, Mingli Fu
Publikováno v:
Materials & Design, Vol 191, Iss , Pp - (2020)
Polymer composites with high thermal conductivity have promising applications for the thermal management of modern electronic devices. Here, a novel strategy is proposed to enhance the thermal conductivity of epoxy composites by employing a hybrid gr
Externí odkaz:
https://doaj.org/article/d3db024316c6439d88a22feece334d24
Publikováno v:
Materials, Vol 14, Iss 18, p 5251 (2021)
Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here,
Externí odkaz:
https://doaj.org/article/540d375182164bbead756c4d61abfd71
Publikováno v:
Nanomaterials, Vol 11, Iss 10, p 2544 (2021)
Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity
Externí odkaz:
https://doaj.org/article/798331c3b48640a19109da1cf9ae0939
Publikováno v:
ACS Applied Nano Materials. 6:1272-1284
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad90c770481f59a2b2d8c57315929e10
https://doi.org/10.1021/acsanm.2c04855
https://doi.org/10.1021/acsanm.2c04855
Autor:
Lihua, Zhao, Zhijie, Chen, Junwen, Ren, Lingyu, Yang, Yuchao, Li, Zhong, Wang, Wenjun, Ning, Shenli, Jia
Publikováno v:
Journal of Colloid and Interface Science. 627:205-214
Polymer-based dielectrics with high thermal conductivity and superb dielectric properties hold great promising for advanced electronic packaging and thermal management application. However, integrating these properties into a single material remains
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0397ec119cc0bb86a5a604a948055d52
https://doi.org/10.1016/j.jcis.2022.07.058
https://doi.org/10.1016/j.jcis.2022.07.058