Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Junta Inoue"'
Publikováno v:
Journal of Smart Processing. 11:227-232
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d79b5eee76c813626760674ee6f5672
https://doi.org/10.7791/jspmee.11.227
https://doi.org/10.7791/jspmee.11.227
Publikováno v:
IMAPSource Proceedings. 2022
The various kinds of the packaging technologies such as 2.nD, 2.5D, 3D are highly studied with the rapid development of miniaturization and high density of semiconductor packaging. This trend increases the importance of fine pitch interconnect. To ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::853e65282393bb5c74c84b2e2ee689eb
https://doi.org/10.4071/001c.74592
https://doi.org/10.4071/001c.74592
Autor:
Atsushi Mizoguchi, Junta Inoue
Publikováno v:
The Proceedings of the Transportation and Logistics Conference. :233-236
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::542c6548bde9342302554cd1cf29eb81
https://doi.org/10.1299/jsmetld.2009.18.233
https://doi.org/10.1299/jsmetld.2009.18.233
Autor:
Junta Inoue, Hayato Nakamura
Publikováno v:
The Proceedings of International Symposium on Seed-up and Service Technology for Railway and Maglev Systems : STECH. 2009:354337-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc076659c33a483ac778b34ecb820b85
https://doi.org/10.1299/jsmestech.2009._354337-1_
https://doi.org/10.1299/jsmestech.2009._354337-1_
Autor:
Junta Inoue, Atsushi Mizoguchi
Publikováno v:
The Proceedings of International Symposium on Seed-up and Service Technology for Railway and Maglev Systems : STECH. 2009:354018-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ac1d317f56e42da6586143a87fcb4af
https://doi.org/10.1299/jsmestech.2009._354018-1_
https://doi.org/10.1299/jsmestech.2009._354018-1_