Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Junmiao Wu"'
Autor:
Liangxia Ai, Yafei Li, Li Zhou, Wenrong Yao, Hao Zhang, Zhaoyu Hu, Jinyu Han, Weijie Wang, Junmiao Wu, Pan Xu, Ruiyue Wang, Zhangyi Li, Zhouwang Li, Chengliang Wei, Jianqun Liang, Haobo Chen, Zhimiao Yang, Ming Guo, Zhixiang Huang, Xin Wang, Zhen Zhang, Wenjie Xiang, Dazheng Sun, Lianqiang Xu, Meiyan Huang, Bin Lv, Peiqi Peng, Shangfeng Zhang, Xuhao Ji, Huiyi Luo, Nanping Chen, Jianping Chen, Ke Lan, Yong Hu
Publikováno v:
Cell Discovery, Vol 9, Iss 1, Pp 1-15 (2023)
Abstract Advanced mRNA vaccines play vital roles against SARS-CoV-2. However, most current mRNA delivery platforms need to be stored at −20 °C or −70 °C due to their poor stability, which severely restricts their availability. Herein, we develo
Externí odkaz:
https://doaj.org/article/73dae6977b1042ecb99db5da53664c88
Publikováno v:
Civil Engineering and Energy-Environment Vol 2 ISBN: 9781003433651
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dafc204788d609d96756e1a0d2ae6a09
https://doi.org/10.1201/9781003433651-20
https://doi.org/10.1201/9781003433651-20
Publikováno v:
Civil Engineering and Energy-Environment Vol 1 ISBN: 9781003433644
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0348b4f2c34998e129d6d7d45daa667b
https://doi.org/10.1201/9781003433644-67
https://doi.org/10.1201/9781003433644-67
Autor:
Songyan Liu, Guangdi Shen, Jun Deng, Junmiao Wu, Peng Lian, Deshu Zou, Nanhui Niu, Lan Li, Yanli Shi
Publikováno v:
Current Applied Physics. 2:373-378
The main problems of conventional multi-quantum well infrared photodetectors (QWIPs) were discussed. In order to overcome the limitations of the conventional QWIPs, such as small photocurrent, high dark current and low response speed, novel QWIPs in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13d72630410fa0c803404d9a2c52c7d3
https://doi.org/10.1016/s1567-1739(02)00142-6
https://doi.org/10.1016/s1567-1739(02)00142-6
Publikováno v:
2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443).
Effects of various dielectric materials on thermal stress in p++ silicon diaphragm were analyzed. In this work the modeling of thin film deposition based on the finite element analysis (FEA) is described. The theoretical results predict the change of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aefe8f9feee1ce8320607bf161e721d1
https://doi.org/10.1109/icsict.2001.982022
https://doi.org/10.1109/icsict.2001.982022
Publikováno v:
2001 6th International Conference on Solid-State & Integrated Circuit Technology. Proceedings (Cat. No.01EX443); 2001, p823-823, 1p