Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Junjiang Lei"'
Publikováno v:
Photomask Technology 2022.
Autor:
Yuangsheng Ma, Rui Wu, Junjiang Lei, Le Hong, Keisuke Mizuuchi, Fan Jiang, Alexander Tritchkov, Yuyang Sun
Publikováno v:
DTCO and Computational Patterning.
Autor:
Rui Wu, Dingyi Hong, Keisuke Mizuuchi, Rehab Ali, Junjiang Lei, Le Hong, Yuansheng Ma, Yuyang Sun, Alexander Tritchkov, Fan Jiang
Publikováno v:
Photomask Technology 2021.
Inverse Lithography Technology (ILT) has become one of the key computational lithography solutions, which may produce mask output that results in better process latitude and CD control on wafer than the one using conventional OPC. However, the curvil
Autor:
Xiaojing Su, Yayi Wei, Tianchun Ye, Feng Shao, Lisong Dong, Junjiang Lei, Jiaxin Lin, Yu Zhu, Ying Chen, Recco Zhang, Chunshan Du, Minghui Fan
Publikováno v:
SPIE Proceedings.
This paper proposes a novel hotspots fixing flow, in which design rule optimization and lithography RET solution are obtained simultaneously. This flow is most effective in the early development phase, and its methodology is rooted from design techno
Autor:
Daman Khaira, J. Andres Torres, Harry J. Levinson, Lei Yuan, Yan Wang, Junjiang Lei, Yuansheng Ma, James Word, Moshe Preil, Joydeep Mitra, Le Hong, Germain Fenger, Jongwook Kye
Publikováno v:
SPIE Proceedings.
In this paper, we present a DSA compliant flow for contact/via layers with immersion lithography assuming the grapho-epitaxy process for cylinders’ formation. We demonstrate that the DSA technology enablement needs co-optimization among material, d
Autor:
Yayi Wei, Yingli Duan, Yajuan Su, Ying Chen, Feng Shao, Junjiang Lei, Recco Zhang, Xiaojing Su
Publikováno v:
SPIE Proceedings.
Design and technology co-optimization (DTCO) can satisfy the needs of the design, generate robust design rule, and avoid unfriendly patterns at the early stage of design to ensure a high level of manufacturability of the product by the technical capa
Autor:
Yingli Duan, Junjiang Lei, Ying Chen, Yajuan Su, Recco Zhang, Yayi Wei, Feng Shao, Xiaojing Su
Publikováno v:
2016 China Semiconductor Technology International Conference (CSTIC).
Design and technology co-optimization (DTCO) is a new technology method, which takes the manufacturing process limitations, mainly lithography, into account during the early design stage. This paper demonstrates a DTCO workflow which includes layout
Publikováno v:
Applicable Analysis. 88:517-528
In this article, we derive an analytical approximation to compute the aerial images on general geometric domains. Under the framework in Hilbert space, we develop a general approximation model for aerial image intensity, which is particularly valid f
Autor:
Alexander Tritchkov, Geert Vanderberghe, Neal Lafferty, Yuansheng Ma, Joost Bekaert, Germain Fenger, Juan Andres Torres, Le Hong, Rachit Gupta, Yuan He, Junjiang Lei, James Word, George P. Lippincott
Publikováno v:
Alternative Lithographic Technologies VII.
In this paper, we present an optimization methodology for the template designs of sub-resolution contacts using directed self-assembly (DSA) with grapho-epitaxy and immersion lithography. We demonstrate the flow using a 60nm-pitch contact design in d
Publikováno v:
SPIE Proceedings.
In the traditional OPC (Optical Proximity Correction) procedure, edges in a layout are broken into fragments and each fragment is iteratively adjusted by multiplying its EPE (Edge Placement Error) with a carefully selected or calculated feedback. How