Zobrazeno 1 - 10
of 80
pro vyhledávání: '"Jungsub Kim"'
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 6, Iss 5, p 97 (2022)
This paper introduces a novel approach to in-process monitoring of the cutting temperature at the tool-chip interface (TCI). Currently, there are no tools available in the commercial market for measuring and monitoring cutting processes at the TCI re
Externí odkaz:
https://doaj.org/article/86c21d9a92d2499e93e32406d9882725
Publikováno v:
Journal of Manufacturing Science & Engineering; Jun2024, Vol. 146 Issue 6, p1-6, 6p
Publikováno v:
Journal of Manufacturing Processes. 95:492-496
Autor:
Wonjae Chang, Jungsub Kim, Myoungsoo Kim, Min Woo Lee, Chung Hyun Lim, Gunho Kim, Sunghyun Hwang, Jeeyoung Chang, Young Hwan Min, Kiseong Jeon, Soohyun Kim, Yoon-Ho Choi, Jeong Soo Lee
Publikováno v:
Nature. 617:287-291
Autor:
Hanseo Kim, Jungsub Kim
Publikováno v:
The Society for Cognitive Enhancement and Intervention. 14:87-104
Autor:
Hyungran Kim, Jungsub Kim
Publikováno v:
The Society for Cognitive Enhancement and Intervention. 13:63-79
Publikováno v:
Journal of Manufacturing Processes. 77:361-368
This paper introduces a simple three-dimensional (3D) stereoscopic method using a single unit of an imaging device consisting of a charge-coupled device (CCD) and a zoom lens. Unlike conventional stereoscopy, which requires a pair of imaging devices,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::873130d4e2e2d3119be0e0a63d03bb45
https://doi.org/10.21203/rs.3.rs-2640246/v1
https://doi.org/10.21203/rs.3.rs-2640246/v1
This paper introduces a computer vision technique for wafer particle metrology and inspection. Artificially generated particle images based on their color properties were used to verify HSV (hue, saturation, value) color space models of each particle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24692a401129ce21e2c71ed6a37daa42
https://doi.org/10.21203/rs.3.rs-2500543/v1
https://doi.org/10.21203/rs.3.rs-2500543/v1
Autor:
EunKyung Park, JungSub Kim
Publikováno v:
Korean Association For Learner-Centered Curriculum And Instruction. 22:323-340