Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Jung-Hoon Moon"'
Publikováno v:
Foodservice Management Society of Korea. 24:199-226
Autor:
Jung-Hoon Moon, Suhyun Choi
Publikováno v:
Foodservice Management Society of Korea. 24:345-372
Publikováno v:
The Korea Learning Disabilities Association. 17:55-77
Publikováno v:
International Journal of Contents. 12:45-52
This study focuses on finding ways to stimulate the growth of agricultural sectors in m-businesses, by analyzing and comparing the factors that influence the purchasing behavior of consumers in the open market, social commerce, and integrated shoppin
Publikováno v:
Agribusiness and Information Management. 2:89-102
Autor:
Jong-Woong Kim, Jeong-Won Yoon, Seung-Boo Jung, Dae-Gon Kim, Yu-Na Kim, Ja-Myeong Koo, Jung-Hoon Moon, Bo-In Noh
Publikováno v:
Materials Science and Engineering: A. :620-624
The effect of displacement rate and intermetallic compound growth on the shear properties of the electroplated Sn–37Pb (wt.%) flip-chip solder bumps with Cu under-bump metallization (UBM) were investigated after multiple reflows. The compounds Cu6S
Publikováno v:
Asia Marketing Journal. 15
The purpose of this paper is to investigate upon a diversification strategy through market creation of CJ Group, which has contributed in positioning of the firm as one of the leading conglomerates in South Korea. With such objective, the background
Autor:
Changhoon Yun, Seok-joo Lim, Taewoo Koo, Youngdoo Cho, Seong-kook Shin, Sanggon Lee, Jung-hoon Moon
Publikováno v:
SAE Technical Paper Series.
Autor:
Jung-Hoon Moon, Yu-Na Kim, Jung-Lae Jo, Jong-Bum Lee, Seung-Boo Jung, Jeong-Won Yoon, Ja-Myeong Koo
Publikováno v:
Proceedings of the Interntional Congress on Ultrasonics.
Autor:
In-Ho Jeong, Choong-Mo Nam, Chang Yup Lee, Young-Se Kwon, Jung Hoon Moon, Dong-Wook Kim, Jongsoo Lee
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
The strong pressure of cost and size reduction in wireless industry makes the phone makers find new and revolutionary solutions for their products. Among the various approaches, the passive integration is the most attractive way. To achieve both goal