Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Jung Yoon Hwang"'
Autor:
Na Kyung Ryu, Jung-Yoon Hwang, Kyeong-Min Kim, Kang Cheonsik, Seong-Woo Cho, Kyeong-Hoon Kim, Ji-Woo Kim, Ri Choe, Chul Soo Park
Publikováno v:
Korean Journal of Breeding Science. 52:362-373
Autor:
Young Hak Shim, Jung Yoon Hwang
Publikováno v:
Journal of Society of Korea Industrial and Systems Engineering. 36:24-35
Autor:
Jung Yoon Hwang, Younghak Shim
Publikováno v:
Journal of Society of Korea Industrial and Systems Engineering. 35:1-9
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 24:377-384
This paper proposes a new yield model for integrated circuits using a spatial point process. The defect density variation by location on a wafer is modeled by a spatial nonhomogeneous Poisson process. The intensity function of the yield model describ
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 22:344-350
Critical defects, i.e., faults, inevitably occur during semiconductor fabrication, and they significantly reduce both manufacturing yield and product reliability. To decrease the effects of the defects, several fault-tolerance methods, such as the re
Publikováno v:
IIE Transactions. 39:1073-1083
In this paper we propose spatial modeling approaches for clustered defects observed using an Integrated Circuit (IC) wafer map. We use the spatial location of each IC chip on the wafer as a covariate for the corresponding defect count listed in the w
Autor:
Way Kuo, Jung Yoon Hwang
Publikováno v:
European Journal of Operational Research. 178:143-153
This paper studies the defect data analysis method for semiconductor yield enhancement. Given the defect locations on a wafer, the local defects generated from the assignable causes are classified from the global defects generated from the random cau
Autor:
JUNG YOON HWANG1 jungyoon.hwang@samsung.com, HYUN CHEOL LEE2 hclee@kau.ac.kr
Publikováno v:
Journal of Quality Technology. Oct2014, Vol. 46 Issue 4, p323-339. 17p.
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Aug2009, Vol. 22 Issue 3, p344-350, 7p, 3 Black and White Photographs, 4 Graphs