Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Jung Chih Hu"'
Autor:
Sheng Chen Twan, Shih Hsien Huang, Lien Tai Chen, Jung Chih Hu, Tu Lee, Sheng Wei Lee, Shao Liang Cheng
Publikováno v:
Journal of Alloys and Compounds. 586:S362-S367
The influence of Al addition on the phase transformation and thermal stability of Ni silicides on (0 0 1)Si has been systematically investigated. The presence of Al atoms is found to slow down the Ni 2 Si–NiSi phase transformation but significantly
Autor:
Jeng Wei Chen, Tu Lee, Lien Tai Chen, Jung Chih Hu, Tsung Yan Lin, Hung Lin Lee, Yee Chen Tsai, Shao Liang Cheng, Sheng Wei Lee
Publikováno v:
Chemical Engineering Journal. 225:809-817
Although ammonium nitrate (AN) is a clean burning (chlorine free), non-corrosive, low-hazard, low-flame temperature, inexpensive, easily available energetic material and gives maximum gas horse power per unit weight, propellants incorporating AN suff
Autor:
Sheng Wei Lee, Jung Chih Hu, Tsung Yan Lin, Shao Liang Cheng, Hung Lin Lee, Yee Chen Tsai, Tu Lee, Meng Hsun Tsai, Zheng Xin Liu, Lien Tai Chen
Publikováno v:
Advanced Materials Research. 699:392-397
The sensors of taste and odor play important roles of recognition as well as reception. In our research, the taste and odor sensing capabilities were based on the photoluminescence (PL) responses of luminescent metal-organic frameworks (MOFs). For th
Autor:
Jung Chih Hu, Wen-Wei Wu, Cheng Lun Hsin, Fu Hsuan Chu, Jui Yuan Chen, Lien Tai Chen, Jr-Hau He, Chen Fang Kang, Shih Ying Yu, Yu Ting Huang, Chun Wei Huang
Publikováno v:
Analytical Chemistry. 85:3955-3960
Resistive random-access memory (ReRAM) has been of wide interest for its potential to replace flash memory in the next-generation nonvolatile memory roadmap. In this study, we have fabricated the Au/ZnO-nanowire/Au nanomemory device by electron beam
Publikováno v:
Applied Surface Science. 264:732-736
We present here the results of studies of the synthesis and growth behaviors of electroless pure Co thin films on Pd-activated Si substrates using hydrazine as the reductant. Using the hydrazine-modified electroless Co plating processes, dense and co
Publikováno v:
Advanced Materials. 18:1147-1151
Metal and semiconductor nanoparticles display fascinating size-dependent structural, electronic, optical, magnetic, and chemical properties, which make them promising materials to be tailored and functionalized as fundamental building blocks for emer
Autor:
Jung Chih Hu, Sheng Wei Lee, Lien Tai Chen, Shao Liang Cheng, Meng Hsun Tsai, Hung Lin Lee, Tu Lee
Publikováno v:
Biosensorsbioelectronics. 43
The taste sensing capabilities of a “biomimetic tongue” based on the photoluminescence (PL) responses of metal–organic frameworks (MOFs), [In(OH)(bdc)] n (bdc=1,4-benzenedicarboxylate), [Tb(btc)] n (MOF-76, btc=benzene-1,3,5-tricarboxylate), an
Autor:
Wen-Chih Chiou, Weng-Jin Wu, Hun-Hsien Chang, Kuo-Nan Yang, Hung-Jung Tu, C.H. Yu, Jung-Chih Hu
Publikováno v:
2008 International Interconnect Technology Conference.
A three dimensional integrated circuit (3DIC) integration flow, process and electrical results are reported. Well-controlled high aspect ratio (AR=8:1 and AR=15:1) through silicon vias (TSVs) were successfully filled with both copper (Cu) and tungste
Autor:
Jung-Chih Hu, 胡榮治
88
Metal (Ti, TiN) chemical vapor deposition (CVD) and copper electrodeposition for future ULSI metallization applications have been investigated. For CVD barrier deposition, the conformal TiN films were deposited by thermal low-pressure chemica
Metal (Ti, TiN) chemical vapor deposition (CVD) and copper electrodeposition for future ULSI metallization applications have been investigated. For CVD barrier deposition, the conformal TiN films were deposited by thermal low-pressure chemica
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/07310167978700391886
Autor:
Cheng Lun Hsin, Jui Yuan Chen, Chung Hua Chiu, Lien Tai Chen, Wen-Wei Wu, Chun Wei Huang, Jung Chih Hu, Yu Ting Huang
Publikováno v:
Nanoscale. 5:5086
Copper silicide has been studied in the applications of electronic devices and catalysts. In this study, Cu3Si/Si nanowire heterostructures were fabricated through solid state reaction in an in situ transmission electron microscope (TEM). The dynamic