Zobrazeno 1 - 10 of 164 pro vyhledávání: '"Jung Been You"'
2
Akademický článek
Role of W addition in reducing heat checking and enhancing the mechanical properties of hot work tool steel
Autor: Yoon-Jung Won, Young-Jun Kwon, Jung-Sun You, Sung-Soo Park, Ki-Sub Cho
Publikováno v: Journal of Materials Research and Technology, Vol 24, Iss , Pp 3413-3422 (2023)
The influence of carbide precipitation on the mechanical properties of hot work tool steels was investigated in this study. Compared to the commercial H13 hot work tool steel, the KMoW and RW steels containing W exhibited a reduced high-temperature s
Externí odkaz: https://doaj.org/article/5b75b28330a7462686261141d3c50b94
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6
Akademický článek
High-Performance Screen-Printed Thermoelectric Films on Fabrics
Autor: Sunmi Shin, Rajan Kumar, Jong Wook Roh, Dong-Su Ko, Hyun-Sik Kim, Sang Il Kim, Lu Yin, Sarah M. Schlossberg, Shuang Cui, Jung-Min You, Soonshin Kwon, Jianlin Zheng, Joseph Wang, Renkun Chen
Publikováno v: Scientific Reports, Vol 7, Iss 1, Pp 1-9 (2017)
Abstract Printing techniques could offer a scalable approach to fabricate thermoelectric (TE) devices on flexible substrates for power generation used in wearable devices and personalized thermo-regulation. However, typical printing processes need a
Externí odkaz: https://doaj.org/article/f833e3f7062f435e883271c540421267
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9
Critical Evaluation and Thermodynamic Re-Optimization of the Si–P and Si–Fe–P Systems
Autor: Jung, Zhimin You, Hao Zhang, Senlin Cui, Zhouhua Jiang, In-Ho
Publikováno v: Materials; Volume 16; Issue 11; Pages: 4099
Thermodynamic modeling of the Si–P and Si–Fe–P systems was performed using the CALculation of PHAse Diagram (CALPHAD) method based on critical evaluation of available experimental data in the literature. The liquid and solid solutions were desc
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=multidiscipl::cae3df39886db51e5eaa3273a04c918d
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10
Periodical
Layer and Length-Deviation Limit Aware Interposer Routing for Bend and Wirelength Minimization
Autor: Park, Hyungjun, Kim, Byung-In, Choi, Dong Gu, Kyu Kim, Hyun, Wook Kang, Tae, Jung Lee, You
Publikováno v: Components, Packaging, and Manufacturing Technology, IEEE Transactions on; 2024, Vol. 14 Issue: 6 p993-1006, 14p
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