Zobrazeno 1 - 6
of 6
pro vyhledávání: '"June-Chien Chang"'
Autor:
June-Chien Chang, 張榮謙
93
From deep submicron to very deep submicron (VDSM) in IC process, IC circuit design becomes more and more complex and the multi million gates IC is more and more popular. Because the plenty requirement of IC functions lead to the faster IC cir
From deep submicron to very deep submicron (VDSM) in IC process, IC circuit design becomes more and more complex and the multi million gates IC is more and more popular. Because the plenty requirement of IC functions lead to the faster IC cir
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/09527987287643026188
Autor:
Wei-Kuo Han, H.H. Lin, June-Chien Chang, Y. T. Lin, Kuo-Shu Kao, Chih-Ming Tzeng, T. C. Chang
Publikováno v:
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD).
This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bae8b93ff0f59414a6c96a4997ac9f32
https://doi.org/10.1109/ispsd.2019.8757581
https://doi.org/10.1109/ispsd.2019.8757581
Publikováno v:
2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).
The design and packaging issues associated with a 50KVA 450A power electronic module using parallel configuration of 1200V, 50A silicon carbide (SiC) MOSFETs and diodes are presented. The module was designed to fit into an existing package housing wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4eaf318cec629c79a25d8dc419c3760
https://doi.org/10.1109/pedg.2013.6785595
https://doi.org/10.1109/pedg.2013.6785595
Autor:
null Chun-Kai, null Liu, Yu-Lin Chao, June-Chien Chang, Wei Li, Chih-Ming Tzeng, Rong-Chang Fang, Kuo-Shu Kao, Tao-Chih Chang, Chang-Sheng Chen, Ming-Kan Liang, Wei-Chung Lo
Publikováno v:
2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).
Insulated gate bipolar transistor (IGBT) power modules are widely used in household, industry and vehicle applications due to the features of higher efficiency, smaller size, low cost and higher reliability. However, the large power dissipation of IG
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaba2ceb20e7100701c9849a90e3afad
https://doi.org/10.1109/pedg.2013.6785626
https://doi.org/10.1109/pedg.2013.6785626
Autor:
Wei-Chung Lo, Wei Li, June-Chien Chang, Rong-Chang Fang, Yu-Lin Chao, Chih-Ming Tzeng, Kuo-Shu Kao, Tao-Chih Chang, Chun-Kai Liu, Chang-Sheng Chen
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
Insulated gate bipolar transistor (IGBT modules are widely used in power electronics applications such as vehicle and household applications as well as industry to realize energy savings with higher efficiency, smaller size, low cost, higher reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::952548a8d6150612f38618f050ac194f
https://doi.org/10.1109/emap.2012.6507920
https://doi.org/10.1109/emap.2012.6507920
Autor:
Chun-Kai Liu, Yu-Lin Chao, June-Chien Chang, Wei Li, Chih-Ming Tzeng, Rong-Chang Fang, Kuo-Shu Kao, Tao-Chih Chang, Chang-Sheng Chen, Wei-Chung Lo
Publikováno v:
2012 14th International Conference on Electronic Materials & Packaging (EMAP); 2012, p1-4, 4p