Zobrazeno 1 - 4 of 4 pro vyhledávání: '"Jun-Xing Yu"'
2
Effects of Wet Activation Process Parameters on Surface Hydrophilicity in Silicon Direct Wafer Bonding
Autor: Jun Xing Yu, Lei Nie, Kun Zhang
Publikováno v: Applied Mechanics and Materials. 235:250-253
Wet activation is a very important step in silicon direct wafer bonding process and a optimized activation process is desirable to improve the surface hydrophilicity. Therefore the pivotal parameters of activation process were investigated which were
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::42cb2ec2d64ba44ffca1efca49045ff4
https://doi.org/10.4028/www.scientific.net/amm.235.250
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3
Multilayer Masking Technique for Deep Isotropic Silicon Wet Etching
Autor: Kun Zhang, Lei Nie, Jun Xing Yu
Publikováno v: Applied Mechanics and Materials. :2444-2447
A multilayer masking technique was presented aiming at the requirements of deep isotropic silicon wet etching. Because the processing time of deep etching is relatively long and etching rate is high, it is very hard to achieve satisfying etching resu
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a0446e278dd35e664b7539a6be25c3f0
https://doi.org/10.4028/www.scientific.net/amm.229-231.2444
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