Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Jun-Wei Shen"'
Autor:
Yong-Hui Li, Xiao-Ying Wang, Jun-Wei Shen, Lin-Lin Ma, Cui-Ping Wang, Kai He, Ding-Sheng Liu, Yan-Fei Li
Publikováno v:
Journal of International Medical Research, Vol 51 (2023)
Objective The average 5-year survival rate of breast cancer (BC) patients has been significantly prolonged with new therapeutic methods. However, their effects on BC patient long-term survival rates are unclear. Therefore, this study aimed to analyze
Externí odkaz:
https://doaj.org/article/2209fe472fc0408c8462f408b234b041
Autor:
Xin Kang Li, Jun Wei Shen, Hai Lan Lin, Zhao Xin Zhang, Xun Tao Zhang, Jun Bian, Dai Qiang Chen
Publikováno v:
Journal of Applied Polymer Science. 140
Autor:
Zhao Xin Zhang, Shang Ke Yang, Jun Wei Shen, Jia Yang, Jun Bian, Ai Ping Zhang, Hai Lan Lin, Dai Qiang Chen
Publikováno v:
Journal of Polymer Research. 29
Autor:
Hiroyuki Mayama, Satoshi Yokojima, Jun-Wei Shen, Takayuki Minami, Shinichiro Nakamura, Kaoru Tsujii
Publikováno v:
Soft matter. 4(1)
Alkylketene dimer (AKD: a kind of wax) spontaneously forms a fractal structure and its surfaces show super water-repellency (the contact angle = 174°). However, the formation mechanism of the fractal surfaces of AKD is still unclear. In this work, s
Publikováno v:
Journal of Ambient Intelligence and Humanized Computing. 10:2633-2643
Due to the cost, power requirements and capacity, data are mainly stored off-chip rather than on-chip in embedded systems. The data exchanged between the processor and off-chip memory might be sensitive, security and efficiency of off-chip memory is
Autor:
Lan Wu, Yan-Fei Li, Jun-Wei Shen, Qian Zhu, Jing Jiang, Shi-Hua Ma, Kai He, Zhong-Ping Ning, Jue Li, Xin-Ming Li
Publikováno v:
Physiological Genomics; Jan2022, Vol. 54 Issue 1, p11-21, 11p
Autor:
Hiroya Kodama, Jun-Wei Shen, Hidehiro Yamamoto, Hideki Kiritani, Tetsuharu Yuge, Makoto Ikemoto, Sugiyama Masaya, Kan Takeshita, Yasuhiro Kawase
Publikováno v:
International Symposium on Microelectronics. 2016:000333-000337
Pre-applied underfill, which is also called inter chip fill (ICF), was developed for 2D and 3D chip stack integration. We prepared many types of formulations that have a variety of chemical and mechanical properties. Using these ICFs and test vehicle
A study on the relationship between microstructure and mechanical properties of porous polymer films
Autor:
Jun-Wei Shen, Hajime Matsumoto, Toshihiko Kuriyama, Tomoyuki Nemoto, Hisao Takeuchi, Shunsuke Koido, Akira Maki
Publikováno v:
Polymer. 204:122784
To understand the porous polymer films' mechanical behavior from the perspective of their structural features, a three-dimensional reconstruction based on the focused ion beam/scanning electron microscope images was applied to obtain the microstructu
Publikováno v:
Journal of Electronics & Information Technology. 34:1744-1747
Publikováno v:
Bulletin of the Chemical Society of Japan. 85:1318-1328
Molecular dynamics (MD) simulations were used to investigate the dissociation of the Ras/Raf complex. Three models of Ras/Raf complexes were used in this study: two active GTP-bound forms with eith...