Zobrazeno 1 - 10
of 118
pro vyhledávání: '"Jun Yeob Song"'
Autor:
Hakyung Jeong, Jae Hak Lee, Seungman Kim, Seongheum Han, Hyunkyu Moon, Jun-Yeob Song, Ah-Young Park
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-12 (2023)
Abstract Aerosol jet printing (AJP) is a new non-contact direct writing technique designed to achieve precise and intricate patterns on various substrates. Specifically, the pneumatic AJP process breaks down the ink into fine particles, significantly
Externí odkaz:
https://doaj.org/article/7a42a5fe3329434197975b4925d6333d
Publikováno v:
Nanomaterials, Vol 13, Iss 1, p 32 (2022)
The roll-to-roll (R2R) continuous patterning of silver nanowire-polyvinylpyrrolidone (Ag NW-PVP) composite transparent conductive film (cTCF) is demonstrated in this work by means of slot-die coating followed by selective calendering. The Ag NWs were
Externí odkaz:
https://doaj.org/article/38282b14806a4424aa7db5ccf2868d0b
Publikováno v:
Journal of the Korean Society for Precision Engineering. 40:175-184
Autor:
Seungman Kim, Seongheum Han, Jae Seung Lim, Sumin Kang, Seunghwoi Han, Jae-Hak Lee, Ah-Young Park, Jun-Yeob Song
Publikováno v:
Advances in Display Technologies XIII.
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Autor:
Ah-Young Park, Jae Hak Lee, Seungman Kim, Sumin Kang, Seongheum Han, Seong-Il Kim, Jun-Yeob Song
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
Sumin Kang, Jae Hak Lee, Seung Man Kim, Jaeseung Lim, Ah-Young Park, Seongheum Han, Jun-Yeob Song, Seong-Il Kim
Thermo-mechanical analysis of monolithic microwave integrated circuit (MMIC) packaging is essential to guarantee the reliability of radio frequency/microwave applications. However, a method for fast and accurate analysis of MMIC packaging structures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cd6d8945f18e902b5743bb710b5edab
https://doi.org/10.21203/rs.3.rs-1931145/v1
https://doi.org/10.21203/rs.3.rs-1931145/v1
Autor:
Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Publikováno v:
Journal of Electronic Packaging. 144
Although the reliability of flexible electronics during bending deformation is of great interest nowadays, the mechanical reliability that has mainly been investigated is of single electronic components or simple devices, such as metal interconnect,
Autor:
Dong-Hoon Kim, Jun-Yeob Song
Publikováno v:
Transaction of the Korean Society of Automotive Engineers. 28:721-726
Autor:
Cha-Hee Kim, Hyeonji Yun, Seung-Ho Seo, Byoung-Joon Kim, Jae-Hak Lee, Jun-Yeob Song, Won-Jun Lee
Publikováno v:
ECS Journal of Solid State Science and Technology. 11:045015
We modeled flexible microelectronic systems and analyzed the stress and strain distribution assuming an international standard bending test evaluating flexible electronics. The flexible microelectronic system consisted of a flexible substrate, a thin