Zobrazeno 1 - 10
of 151
pro vyhledávání: '"Jun Tatebayashi"'
Autor:
Takenori Iwaya, Shuhei Ichikawa, Volkmar Dierolf, Brandon Mitchell, Hayley Austin, Dolf Timmerman, Jun Tatebayashi, Yasufumi Fujiwara
Publikováno v:
AIP Advances, Vol 14, Iss 2, Pp 025044-025044-6 (2024)
For the development of III-nitride-semiconductor-based monolithic micro-light-emitting diode (LED) displays, Eu,O-codoped GaN (GaN:Eu,O) is a promising material candidate for the red LEDs. The luminescence efficiency of Eu-related emission strongly d
Externí odkaz:
https://doaj.org/article/5416eb642f004e6795e51af28962c422
Publikováno v:
Journal of the Society of Materials Science, Japan. 71:811-818
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c510d5fda2853928978e40dbc827903f
https://doi.org/10.2472/jsms.71.811
https://doi.org/10.2472/jsms.71.811
Autor:
Hiroto Honda, Soshi Umeda, Kanako Shojiki, Hideto MIYAKE, Shuhei Ichikawa, Jun Tatebayashi, Yasufumi FUJIWARA, Kazunori Serita, Hironaru Murakami, Masayoshi Tonouchi, Masahiro Uemukai, Tomoyuki TANIKAWA, Ryuji KATAYAMA
Publikováno v:
Applied Physics Express.
Far-ultraviolet (UV) light sources have attracted much attention for human safe viral inactivation and bacterial disinfection. Due to large optical nonlinearity and transparency to this wavelength region, second harmonic generation (SHG) device made
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::280357ebf85ef0cd7f50ce72d1fa3775
https://doi.org/10.35848/1882-0786/acda79
https://doi.org/10.35848/1882-0786/acda79
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61cd5292148e6aa7ebb03b446be53b98
https://doi.org/10.23919/icep58572.2023.10129733
https://doi.org/10.23919/icep58572.2023.10129733
Publikováno v:
2022 29th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2c74c06ad6528db7577e45e14fdbd54
https://doi.org/10.23919/am-fpd54920.2022.9851283
https://doi.org/10.23919/am-fpd54920.2022.9851283
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1731712c1a732b6485327b5f9e464ecc
https://doi.org/10.23919/icep55381.2022.9795364
https://doi.org/10.23919/icep55381.2022.9795364
Autor:
Yasufumi Fujiwara, Masahiko Kondow, Dolf Timmerman, Natsuki Fujioka, Ryoma Higashi, Jun Tatebayashi, Masayuki Ogawa, Shuhei Ichikawa
Publikováno v:
Journal of the Society of Materials Science, Japan. 69:823-828
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28fd760e34d2e3221f3bb23370c5acd9
https://doi.org/10.2472/jsms.69.823
https://doi.org/10.2472/jsms.69.823
Publikováno v:
Journal of the Society of Materials Science, Japan. 69:721-726
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10a660ffaf9a222ecd62d48428c97acd
https://doi.org/10.2472/jsms.69.721
https://doi.org/10.2472/jsms.69.721
Autor:
Dolf Timmerman, Keishi Shiomi, Yasufumi Fujiwara, Tomohiro Inaba, Jun Tatebayashi, Shuhei Ichikawa
Publikováno v:
Journal of the Society of Materials Science, Japan. 69:762-766
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b645a80aaa37f2ac3165e04db4ee173
https://doi.org/10.2472/jsms.69.762
https://doi.org/10.2472/jsms.69.762
Publikováno v:
SID Symposium Digest of Technical Papers. 51:691-694
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfec2f59745c15fd4d8e944b2a9604b4
https://doi.org/10.1002/sdtp.13962
https://doi.org/10.1002/sdtp.13962