Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Jun Sae Han"'
Autor:
Jong-Keun Sim, Dong-Hyun Seo, Eun-Ji Gwak, Ji-Young Jeong, Hwan-ho Maeng, Tae-Jin Je, Doo-Sun Choi, Shinill Kang, Jun Sae Han
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 511-522 (2024)
Piezoelectric single crystals are multifunctional materials used in advanced ultrasound devices owing to their exceptional piezoelectric properties. Nevertheless, machining methods for these single crystals have been limited due to their brittle natu
Externí odkaz:
https://doaj.org/article/d9e60d5e23c24ef1a096378f8b970f90
Autor:
Ji-Youn Kwak, Ji-Young Jeong, Ye-Pil Kwon, Dong-Hyun Seo, Chung-Mo Kang, Dong-Hyeon Kim, Jun Sae Han, Eun-Ji Gwak, Doo-Sun Choi, Ju-Young Kim, Tae-Jin Je, Eun-chae Jeon
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-11 (2023)
Abstract There has been significant research focused on the development of stretchable materials that can provide a large area with minimal material usage for use in solar cells and displays. However, most materials exhibit perpendicular shrinkage wh
Externí odkaz:
https://doaj.org/article/2c365aabe95543758dbc607b81cefdc5
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-16 (2022)
Abstract In ultra-precision planing process, the analysis of the critical depth of cut (DOC) is required to reduce the edge blunt and micro burrs produced by size effect which decreases of the effective area for high luminance retroreflector. However
Externí odkaz:
https://doaj.org/article/b21189ddbcd14f659d39c04566de4f0f
Autor:
Ji-Young Jeong, Je-Ryung Lee, Hyeonjin Park, Joonkyo Jung, Doo-Sun Choi, Eun-chae Jeon, Jonghwa Shin, Jun Sae Han, Tae-Jin Je
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
Abstract Microwave absorbers using conductive ink are generally fabricated by printing an array pattern on a substrate to generate electromagnetic fields. However, screen printing processes are difficult to vary the sheet resistance values for differ
Externí odkaz:
https://doaj.org/article/ee28a9b9084f4ee699862156407c6b75
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 65, Iss No 3, Pp 1099-1103 (2020)
In this study, decomposition and densification behavior of PbAlNbO3-PbZrTiO3 (PAN-PZT) ceramics were characterized for powder injection molding process. Thermal gravity analysis and in-situ dilatometer experiment were carried out to construct master
Externí odkaz:
https://doaj.org/article/0bbf188e494f462f8bfcb8b3b18ddf19
Autor:
Chung-Mo Kang, Yong-joo Baek, Ji-Young Jeong, Jongkeun Sim, Eun-Ji Gwak, Tae-Jin Je, Doo-Sun Choi, Gyu Man Kim, Jun Sae Han
Publikováno v:
Ceramics International. 48:32036-32048
Publikováno v:
Archives of Metallurgy & Materials. 2020, Vol. 65 Issue 3, p1099-1103. 5p.
Autor:
Jae Man Park, Jong Hyun Kim, Jun Sae Han, Da Seul Shin, Sung Cheol Park, Seong Ho Son, Seong Jin Park
Publikováno v:
Materials, Vol 12, Iss 13, p 2056 (2019)
In this study, a fabrication method of tapered microstructures with high aspect ratio was proposed by deep X-ray lithography. Tapered microstructures with several hundred micrometers and high aspect ratio are demanded owing to the high applicability
Externí odkaz:
https://doaj.org/article/aac2f11f8c5c425d95c2b826630d9d54
Autor:
Hanlyun Cho, Juan Godinez, Jun Sae Han, Dani Fadda, Seung Mun You, Jungho Lee, Seong Jin Park
Publikováno v:
Materials, Vol 12, Iss 3, p 507 (2019)
In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern’s size was 100 μm, and the gap size was 50 μm. The short micro-pattern’s hei
Externí odkaz:
https://doaj.org/article/d84c09e8d4c3408c833a812cd9af9629
Autor:
Joo Won Oh, Da Seul Shin, Seong Jin Park, Jin Man Jang, Yong Dae Kim, Jae Man Park, Sung Cheol Park, Jun Sae Han, Won Sik Lee
Publikováno v:
Ceramics International. 46:12023-12030
As a core component of 2D ultrasound transducers, honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays have attracted enormous attention due to their unique performance and functionality. In this paper, honeycomb-shaped 1–3 connecti