Zobrazeno 1 - 10 of 17 pro vyhledávání: '"Jumpei Kusuyama"'
1
Akademický článek
Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)
Autor: Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM
Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00102-17-00102 (2017)
Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This gri
Externí odkaz: https://doaj.org/article/110200f9544746f494924e211bc75d0b
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2
Akademický článek
Development of rotary table grinding machine for large diameter Si wafers (1st report: Performance investigation of water hydrostatic rotary table)
Autor: Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM
Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 842, Pp 16-00190-16-00190 (2016)
Increasing of Si wafer diameter from φ300 mm to φ450 mm is required to enhance productivity of semiconductor devices. The authors developed a high stiff rotary grinding machine, which consists of a rotary table system and a wheel spindle system. Th
Externí odkaz: https://doaj.org/article/6e8c8212acd3456f96963fec94eddea6
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3
Theoretical Derivation of Mean Cutting-Point Space of Grinding Wheel
Autor: Bima Kawase, Yohichi Nakao, Jumpei Kusuyama, Michinosuke Tanaka
In a surface grinding process, a successive cutting-point space of grinding wheel affects the maximum abrasive grain depth of cut, which is a major factor affecting grinding characteristics such as the grinding forces and temperature. These character
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::39395f57f56b1c09f551e9eef5ea6591
https://doi.org/10.3233/atde210014
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4
Proposing a New Evaluation Method in Si Wafer Rotary Grinding
Autor: Bima Kawase, Jumpei Kusuyama, Yohichi Nakao, Masaki Kanazawa, Kazumasa Ishikawa
Publikováno v: JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing.
Although there have been several studies on machining of semiconductor materials, most of them are concerned with abrasive finishing (such as chemical-mechanical polishing, mechanical polishing and lapping), and only a few have reported on optimizing
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ef6efff15c17174383d9402ff6d0a073
https://doi.org/10.1115/lemp2020-8601
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5
Effects of Relative Velocity on Grinding Performances under Si Wafer Rotary Grinding
Autor: Takayuki Kitajima, Akinori Yui, Jumpei Kusuyama, Toshihiro Ito
Publikováno v: Materials Science Forum. 874:395-400
For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::81c18d4343348d4e1e8a37aa5ab8d2da
https://doi.org/10.4028/www.scientific.net/msf.874.395
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6
Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers
Autor: Akinori Yui, Nagahisa Ogasawara, Hirotsugu Saito, Jumpei Kusuyama, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum
Publikováno v: Advanced Materials Research. 1136:655-660
Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grind
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ed190d6cf576222f1e7b77d1c497c529
https://doi.org/10.4028/www.scientific.net/amr.1136.655
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10
Face Milling of Carbon Fiber Reinforced Plastic Using Poly Crystalline Diamond Tool
Autor: Yosuke Itoh, Jumpei Kusuyama, Takayuki Kitajima, Akinori Yui
Publikováno v: Advanced Materials Research. 1017:383-388
Carbon Fiber Reinforced Plastic (CFRP) is a high-strength and high-elastic-modulus composite material that is hardened by impregning carbon fiber with epoxy resin. Although, many sutdies of hole drilling of CFRP have been conducted, few sutdies of fa
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::65157ac5fdeb7908d72f16f74d5fda1a
https://doi.org/10.4028/www.scientific.net/amr.1017.383
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