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Autor:
Soo Bok Chin, Do Hyun Cho, Dongchul Ihm, Byoung-Ho Lee, Hyo Cheon Kang, Chang Lyong Song, Jum Bun Lee, Tae-Yong Lee
Publikováno v:
SPIE Proceedings.
The measurement of edge roughness has become a hot issue in the semiconductor industry. Especially the contact roughness is being more critical as design rule shrinks. Major vendors offer a variety of features to measure the edge roughness in their C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7495b53c8f2240b119dc9596aeb9292f
https://doi.org/10.1117/12.597948
https://doi.org/10.1117/12.597948
